DRAM Process Integration Intern—AI-Enabled Research

Micron Technology, Inc

Boise (ID)

Hybrid

USD 34,000 - 48,000

Full time

7 days ago

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Benefits offered by this job

Medical benefits

Paid time off

Holiday pay

Job summary

Micron Technology, Inc. seeks a Process Integration Intern for DRAM technologies in Boise, Idaho. You will support multi-functional teams across process integration, device engineering, materials development, and process architecture to advance next-generation DRAM memory technologies.

The role requires hands-on use of DOE, data analytics, and problem-solving in a collaborative R&D environment. Excellent communication and planning skills are essential for success in a fast-paced technology

Qualifications

Pursuing MS in Electrical Engineering, Microelectronics, or related field with expected graduation Sept 2027 or later.
Knowledge of semiconductor process integration, device physics, and scaling principles.
Experience using DOE, statistical analysis, and data-driven problem-solving methodologies.
Strong written and verbal communication skills.

Responsibilities

Define technology achievements, design rules, structural requirements, and electrical specifications for next-gen DRAM technologies.
Collaborate with process development, simulation, architecture, circuit design, and quality teams.
Develop and maintain documentation related to process integration plans, risks, issues, and strategies.
Evaluate alternative device architectures and scaling approaches to support future tech development.
Leverage AI/AI-Assisted tools to enhance analysis, data interpretation, productivity, and decision-making.