Director of Optoelectronic IC Packaging

Ciena; New Providence (NJ); On-site; USD 236,000 - 376,000; Full time

Job summary

Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive advanced package development for custom in-house photonic, analog, and digital ICs, enabling next-gen optical modules.

You will own package selection, scheduling, SI/PI optimization, and work with cross-functional groups to optimize silicon floor plans and tapeouts, with a focus on RF performance and manufacturing readiness.

Qualifications

• BS in Electrical Engineering or Physics required.
• Masters/PhD degree a plus.

Responsibilities

• Own and drive advanced package selection, new product BGA configuration, and package structure.
• Own and manage package development schedules.
• Responsible for package layout, SI/PI optimization, design verification and tapeout.
• Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design.
• Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out.
• Simulate and optimize signal and power integrity and RF performance of the package design.
• Interface and work with CMs and vendors for sourcing existing designs and future product development.

Skills

IC package design

Signal & power integrity

RF design fundamentals

Cross-functional collaboration

Education

Bachelor’s in Electrical Engineering or Physics

Advanced degree (MS/PhD) preferred

Tools

Advanced Package Designer (APD)

Xpedition Package Designer (XPD)

Cadence APD/XPD

SIWave/HFSS

Job description

Ciena is seeking an Optoelectronic IC Package Design Director to lead the xPO engineering team and drive advanced package development for custom in-house photonic, analog, and digital ICs, enabling next-gen optical modules.

You will own package selection, scheduling, SI/PI optimization, and work with cross-functional groups to optimize silicon floor plans and tapeouts, with a focus on RF performance and manufacturing readiness.