Optical Integration Lead – Silicon Photonics & EIC

Socket.dev; Fremont (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Coherent Corp. in the United States is seeking an experienced engineering leader to drive packaging development for Co-Packaged Optics and Optical Engine products from concept through production.

You will design PIC and EIC co-design flows, IO pad frames, and 3D interposers while leading cross-functional teams across laser packaging, Silicon Photonics, IC design, substrate layout, and module design. The role requires MS/PhD in engineering or a science discipline with 5+ years of relevant

Qualifications

• MS/PhD in an engineering or science discipline plus 5+ years of relevant experience.
• Experience with semiconductor laser design and silicon photonics.
• Experience with CPO, optical transceivers or components desirable.
• Experience with New Product Introduction (NPI) and/or Product Lifecycle Management processes
• Experience of managing cross-functional teams successfully, interacting with a broad range of functions, skills, cultures, and personalities.

Responsibilities

• Drive Co-Packaged Optics and Optical Engine product packaging activities from initial concept to production.
• Develop Silicon Photonic (PIC) and electronics IC (EIC) co-design process flow, PIC and EIC IO pad frame and 3D interposer floor plan.
• Lead PIC and EIC interconnect schematic and monitor layout design process.
• Work with OSAT’s to define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.
• Lead optical package development to establish package manufacturability and reliability.
• Collaborate with cross-functional teams consisting of laser packaging, Silicon Photonics, IC design, substrate layout, and module design teams.

Skills

Laser photonics

Silicon photonics

High-speed modulation

Problem solving

Communication

Planning

Organizational skills

Education

MS/PhD in engineering or science

Job description

Coherent Corp. in the United States is seeking an experienced engineering leader to drive packaging development for Co-Packaged Optics and Optical Engine products from concept through production.

You will design PIC and EIC co-design flows, IO pad frames, and 3D interposers while leading cross-functional teams across laser packaging, Silicon Photonics, IC design, substrate layout, and module design. The role requires MS/PhD in engineering or a science discipline with 5+ years of relevant