Director of Power Packaging & SiP Engineering

Renesas Electronics Corporation; Dallas (TX); On-site; USD 180,000 - 240,000; Full time

Job summary

Renesas Electronics Corporation in Texas is seeking an experienced Senior Package Engineer to lead advanced power SiP packaging initiatives, including vertical power stages and power modules. You will drive design rules, roadmap execution, and close collaboration with product groups and reliability teams.

The role requires deep expertise in wafer-level and flip-chip packaging, with a track record of delivering robust production-ready solutions.

Qualifications

• PhD/masters/bachelor in a relevant engineering field.
• 15–20 years in package development focusing on power SiP/module.
• Strong understanding of wafer-level and flip-chip packaging methods.
• Knowledge of wire-bonding and multi-chip module technologies is a plus.
• Excellent interpersonal, analytical and presentation skills.

Responsibilities

• Lead package technology development and NPI for AI/Datacenter power packaging.
• Define technology roadmap and manage R&D budget & customer adoption programs.
• Collaborate with OSAT/CM to optimize processes and establish DOE and production specs.
• Resolve process integration issues and ensure quality controls across production ramp-up.

Skills

Power SiP packaging

Wafer-level packaging

Wire-bonding

Interpersonal communication

Analytical skills

Presentation skills

Education

Bachelor/Master/PhD in Physics, Chemistry, Mechanical, Electrical or Materials Engineering

15–20 years experience in package development

Job description

Renesas Electronics Corporation in Texas is seeking an experienced Senior Package Engineer to lead advanced power SiP packaging initiatives, including vertical power stages and power modules. You will drive design rules, roadmap execution, and close collaboration with product groups and reliability teams.

The role requires deep expertise in wafer-level and flip-chip packaging, with a track record of delivering robust production-ready solutions.