Director of Engineering - Advanced Packaging

Ledgent Technology; Sunnyvale (CA); On-site; USD 180,000 - 200,000; Full time

Job summary

Ledgent Technology seeks a Director of Engineering in Sunnyvale, California to lead semiconductor and advanced packaging platforms, including 2.5D/3D integration and system-in-package solutions for global customers.

The role partners with Sales, Factory engineering, and R&D to align roadmaps with customer needs, requiring leadership, market strategy, and strong communication skills. Salary is USD 180k–200k per year.

Qualifications

• Bachelor’s, Master’s, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or related field.
• 12+ years of semiconductor industry experience, preferably in semiconductor packaging or advanced packaging technologies.
• Strong verbal, written, and interpersonal communication skills; ability to deliver technical presentations and customer proposals.

Responsibilities

• Promote strategic technology platforms to global customers; provide technical leadership in engagements with customer engineering teams.
• Collaborate with Sales, Factory engineering, and R&D to align technology requirements and roadmaps.
• Contribute to long-term roadmap development with manufacturing and R&D organizations.

Education

Bachelor’s, Master’s, or Ph.D. in Electrical, Materials, Mechanical, or Chemical Engineering, Physics, or related field

Job description

Ledgent Technology seeks a Director of Engineering in Sunnyvale, California to lead semiconductor and advanced packaging platforms, including 2.5D/3D integration and system-in-package solutions for global customers.

The role partners with Sales, Factory engineering, and R&D to align roadmaps with customer needs, requiring leadership, market strategy, and strong communication skills. Salary is USD 180k–200k per year.