Design Lead: HBM & Advanced Memory

Micron Technology, Inc.; Richardson (TX); Híbrido; USD 180 000 - 240 000; Tempo integral

Resumo da oferta

Micron Technology, Inc. is seeking a Design Lead for HBM and advanced memory design in Richardson, Texas.

You will lead architecture, design, integration, and execution of next-generation memory products, coordinating across design, verification, layout, CAD, product engineering, and technology development teams to meet aggressive schedules. The role requires strong leadership, deep memory design expertise, and a track record of delivering complex ICs with high yield.

Qualificações

• 8+ years in semiconductor design and leadership of IC programs.
• Proven ability to guide complex digital or mixed-signal IC design.
• Experience with RTL (Verilog/SystemVerilog), timing closure, verification, DFT.
• Knowledge of power, performance, and area optimization; silicon validation.

Responsabilidades

• Lead design and execution of complex memory subsystems and top-level integration.
• Own design planning, risk assessment, and schedule execution.
• Coordinate across architecture, verification, layout, CAD, and product teams.
• Review specs and implementation plans; drive design reviews and issue resolution.
• Mentor junior engineers and provide technical leadership.
• Define and improve design methodologies with AI-enabled tools and automation.
• Support silicon bring-up, debug, characterization, and yield improvement.
• Communicate project status and mitigation plans to management.

Conhecimentos

Design leadership

Cross-functional collaboration

Project management

Mentoring

Communication

Technical ownership

Formação académica

Electrical Engineering degree

Ferramentas

Verilog/SystemVerilog

Timing closure

DFT

Synopsys tools

Cadence tools

3D integration

Package integration

Descrição da oferta de emprego

Micron Technology, Inc. is seeking a Design Lead for HBM and advanced memory design in Richardson, Texas.

You will lead architecture, design, integration, and execution of next-generation memory products, coordinating across design, verification, layout, CAD, product engineering, and technology development teams to meet aggressive schedules. The role requires strong leadership, deep memory design expertise, and a track record of delivering complex ICs with high yield.