Design Lead: HBM & Advanced Memory Systems

Micron Technology, Inc.; Richardson (TX); Hybrid; USD 180,000 - 260,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a Design Lead for HBM and advanced memory design in Richardson, TX.

You will guide architecture, design, integration, and execution of next-generation memory products, coordinating with Build, Verification, Layout, CAD, Product Engineering, and Technology Development teams. The role emphasizes technical ownership, leadership across global teams, and delivery on aggressive schedules.

Qualifications

• 20+ years of semiconductor design experience.
• Experience leading complex IC development programs.
• Strong knowledge of digital and/or custom circuit design methodologies.

Responsibilities

• Lead design and execution of complex memory subsystems and top-level integration.
• Own design planning, technical decisions, risk assessment, and schedule execution.
• Coordinate cross-functional teams to ensure design quality and manufacturability.
• Lead design reviews and drive issue resolution across organizations.
• Mentor engineers and provide technical leadership to project teams.
• Support silicon bring-up, debug, characterization, and yield improvement.

Skills

RTL design

Timing closure

Verification

DFT

Power optimization

Leadership

Education

BS/MS/PhD in Electrical/Computer Engineering

Tools

Synopsys

Cadence

Job description

Micron Technology, Inc. seeks a Design Lead for HBM and advanced memory design in Richardson, TX.

You will guide architecture, design, integration, and execution of next-generation memory products, coordinating with Build, Verification, Layout, CAD, Product Engineering, and Technology Development teams. The role emphasizes technical ownership, leadership across global teams, and delivery on aggressive schedules.