Data Center Packaging Engineering Lead

Advanced Micro Devices, Inc.; Santa Clara, Northern (CA, KY); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Advanced Micro Devices, Inc. is seeking a experienced leader to drive end-to-end Data Center GPU and MI package design programs. You will lead cross-functional teams across design, SI/PI, and manufacturing to ensure timely, high-quality package solutions.

You will mentor and grow a high-performing team, foster accountability and innovation, and partner with OSATs and vendors to optimize yield and manufacturability. This role emphasizes leadership, collaboration, and data-driven decision making.

Qualifications

• Experience in semiconductor package design, with strong focus on high-performance or data center products.
• Proven experience leading teams and executing multiple concurrent complex projects in fast-paced environments.
• Strong understanding of package layout, high-speed design considerations, and multi-die integration.
• Experience with AI/ML applications in engineering workflows (design automation, data analytics, optimization).

Responsibilities

• Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are consistently met.
• Drive execution in fast-paced, dynamic environments, managing competing priorities across programs.
• Establish and maintain robust execution frameworks, including milestone tracking, risk management, and readiness gates.
• Interface with senior leadership to provide clear program status, risks, and mitigation strategies.

Skills

Program management

Leadership

Influencing

Communication

Stakeholder management

AI/ML in engineering

Automation

Cross-functional collaboration

Education

B.S. or higher in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field

Tools

Synopsys 3DICC

Cadence SiP / APD

Job description

Advanced Micro Devices, Inc. is seeking a experienced leader to drive end-to-end Data Center GPU and MI package design programs. You will lead cross-functional teams across design, SI/PI, and manufacturing to ensure timely, high-quality package solutions.

You will mentor and grow a high-performing team, foster accountability and innovation, and partner with OSATs and vendors to optimize yield and manufacturability. This role emphasizes leadership, collaboration, and data-driven decision making.