Principal Mechanical Engineer, Advanced Packaging Leader

Advanced Micro Devices, Inc.; San Jose, Northern (CA, KY); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Advanced Micro Devices, Inc. seeks a Principal Mechanical Engineer to lead advanced packaging solutions from concept to production ramp. You will guide mechanical design, simulations, and qualification, collaborating with cross-functional teams to drive high-performance computing and AI hardware.

The role requires hands-on CAD modeling, leadership in technical reviews, and strong experience with cooling solutions and manufacturability. Visa sponsorship is not offered.

Qualifications

• MS or PhD in Mechanical Engineering or related field.
• Experience in advanced packaging, mechanical design, and thermal analysis.
• Strong leadership and mentorship skills.
• Experience with supplier engagement and NPI processes.

Responsibilities

• Perform and lead thermal-mechanical architecture and solution strategy for advanced semiconductor packaging solutions from SoC to system.
• Perform and drive thermal-mechanical design, thermo-mechanical analysis, and integrated solution development from concept through production.
• Perform and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
• Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
• Drive Design for Manufacturability, Design for Assembly, tolerance analysis, FMEA, DVP&R, ECO governance, BOM cost review, and supplier management.
• Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.

Skills

Creo

SolidWorks

ANSYS Mechanical

Thermal-mechanical design

Education

MS in Mechanical Engineering

PhD in related field

Tools

Creo

SolidWorks

ANSYS

DIC/warpage analysis

Job description

Advanced Micro Devices, Inc. seeks a Principal Mechanical Engineer to lead advanced packaging solutions from concept to production ramp. You will guide mechanical design, simulations, and qualification, collaborating with cross-functional teams to drive high-performance computing and AI hardware.

The role requires hands-on CAD modeling, leadership in technical reviews, and strong experience with cooling solutions and manufacturability. Visa sponsorship is not offered.