Senior Packaging Engineering Leader – Data Center GPUs

AMD

Austin (TX)

On-site

USD 180,000 - 260,000

Full time

2 days ago

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Job summary

AMD is seeking a leader to drive the design execution of next-generation Data Center GPU and MI package programs. You will manage cross-functional teams across design, SI/PI, substrate vendors, OSAT partners, and program management to ensure successful execution against tight timelines.

The role requires strong program management, strategic thinking, and the ability to influence across global teams. You will champion AI-enabled automation, design methodologies, and data-driven decision making to

Qualifications

Experience leading semiconductor package design programs.
Proven ability to manage multiple complex projects in fast-paced settings.
Strong leadership and communication with diverse global teams.
Knowledge of high-performance/data center packaging and multi-die integration.

Responsibilities

Lead end-to-end execution of multiple Data Center GPU / MI package design programs, ensuring schedule, quality, and cost targets are met.
Drive execution in dynamic, high-pressure environments with competing priorities across programs.
Establish robust execution frameworks, including milestone tracking, risk management, and readiness gates.
Interface with senior leadership to provide clear program status, risks, and mitigation strategies.