CMP Engineer: Process Optimization & Yield (Onsite Indiana)

NHanced Semiconductors, Inc.; Odon (IN); Presencial; USD 90.000 - 130.000; Jornada completa

Descripción de la vacante

NHanced Semiconductors, Inc. in Odon, Indiana, seeks a CMP Engineer to lead the development and optimization of Chemical Mechanical Planarization processes in a challenging semiconductor packaging environment.

You will design and run DOE studies, qualify equipment and materials, and drive improvements in yield and defect reduction. The role requires collaboration with Process Integration, Equipment Engineering and Metrology teams to enable next‑generation product tech.

Formación

• Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or a related technical discipline.
• Minimum of 3 years of direct CMP experience in a semiconductor manufacturing environment.
• Strong understanding of semiconductor materials and fabrication processes.
• Experience developing and executing DOE.
• Experience with SPC and data-driven optimization.
• Experience qualifying process equipment and implementing improvements.
• Excellent analytical, troubleshooting, and collaboration skills.

Responsabilidades

• Develop, optimize, and sustain CMP processes.
• Design and execute DOE to improve process capability and yield.
• Qualify new equipment, materials, and process changes.
• Monitor process performance and implement corrective actions.
• Utilize SPC methodologies to maintain process health.
• Analyze process data and prepare technical reports.
• Collaborate with Process Integration, Equipment Engineering, and Metrology teams.
• Drive continuous improvement in throughput, yield, and reliability.
• Maintain ownership of CMP equipment and support long-term roadmap initiatives.

Conocimientos

CMP processes

DOE design of experiments

SPC utilization

process optimization

troubleshooting

cross-functional collaboration

Educación

Bachelor's degree in Engineering, Materials Science, Chemistry, or Physics

Descripción del empleo

NHanced Semiconductors, Inc. in Odon, Indiana, seeks a CMP Engineer to lead the development and optimization of Chemical Mechanical Planarization processes in a challenging semiconductor packaging environment.

You will design and run DOE studies, qualify equipment and materials, and drive improvements in yield and defect reduction. The role requires collaboration with Process Integration, Equipment Engineering and Metrology teams to enable next‑generation product tech.