Senior CMP Process Engineer – Advanced Packaging

Micron Technology

Boise (ID)

On-site

USD 140,000 - 190,000

Full time

5 days ago

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Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology is seeking a Staff Process Engineer in Advanced Packaging CMP to startup, develop, and optimize CMP processes for high-quality, reliable semiconductor products. You will drive yield improvements, cost reductions, and risk management while collaborating with regional and international teams.

The role requires hands-on CMP experience, strong problem-solving, and the ability to apply 8D/SPC/FDC methodologies.

Qualifications

BS or MS in Materials Science, Chemical Engineering, Electrical, Mechanical, Chemistry or Physics with 5+ years of CMP experience in semiconductors
Hands-on CMP equipment operation (AMAT LKP, EBARA-300X) and metrology tools
Experience in dielectrics/metals CMP and related semiconductor technologies
Understanding of film deposition, integration constraints and process upstream/downstream effects
Excellent written and verbal communication skills

Responsibilities

Perform fundamental research, consumables development, and hardware evaluation for novel applications
Initiate experiments to widen process margins and evaluate manufacturability of next-generation solutions
Incorporate best manufacturing methods into early development for upcoming nodes
Design and implement advanced process monitoring and control methods
Provide advisory support and lead multi-functional projects for process improvements
Lead strategic projects and contribute to IP through patents or papers
Utilize AI to enhance job functions