CMP Process Engineer - Yield & Advanced Packaging

Quantum Computing Inc.; Odon (IN); On-site; USD 90,000 - 130,000; Full time

Job summary

Quantum Computing Inc. NHanced Semiconductors seeks an experienced CMP Engineer to develop and optimize Chemical Mechanical Planarization processes within our semiconductor packaging environment.

You will lead DOE studies, qualify equipment, and drive yield improvements in a fast-growing site in Indiana. You will collaborate with Process Integration, Equipment Engineering, and Metrology teams to advance product and technology initiatives, and to sustain high-quality CMP processes across

Qualifications

• Bachelor's degree in engineering or related technical discipline.
• Minimum of 3 years CMP experience in semiconductor manufacturing.
• Strong understanding of semiconductor materials and fabrication processes.
• Experience developing and executing DOE.
• Experience with SPC and data-driven optimization.
• Experience qualifying process equipment and implementing improvements.
• Strong analytical, troubleshooting, and communication skills.

Responsibilities

• Develop, optimize, and sustain CMP processes.
• Design and execute DOE to improve capability and yield.
• Qualify new equipment, materials, and process changes.
• Monitor process performance and implement corrective actions to reduce defects.
• Utilize SPC methodologies to maintain process health.
• Analyze process data and prepare technical reports and recommendations.
• Partner with Process Integration, Equipment Engineering, and Metrology teams.
• Drive continuous improvement for throughput, yield, and reliability.
• Maintain ownership of assigned CMP equipment and long-term roadmaps.

Skills

CMP experience

DOE

SPC

Data analysis

Communication

Education

Bachelor's degree (Engineering/Materials/C Chemistry/Physics)

Tools

Process equipment qualification

Job description

Quantum Computing Inc. NHanced Semiconductors seeks an experienced CMP Engineer to develop and optimize Chemical Mechanical Planarization processes within our semiconductor packaging environment.

You will lead DOE studies, qualify equipment, and drive yield improvements in a fast-growing site in Indiana. You will collaborate with Process Integration, Equipment Engineering, and Metrology teams to advance product and technology initiatives, and to sustain high-quality CMP processes across