Chemical Mechanical Planarization Engineer

Quantum Computing Inc.; Odon (IN); Presencial; USD 90.000 - 130.000; Jornada completa

Descripción de la vacante

Quantum Computing Inc. NHanced Semiconductors seeks an experienced CMP Engineer to develop and optimize Chemical Mechanical Planarization processes within our semiconductor packaging environment.

You will lead DOE studies, qualify equipment, and drive yield improvements in a fast-growing site in Indiana. You will collaborate with Process Integration, Equipment Engineering, and Metrology teams to advance product and technology initiatives, and to sustain high-quality CMP processes across

Formación

• Bachelor's degree in engineering or related technical discipline.
• Minimum of 3 years CMP experience in semiconductor manufacturing.
• Strong understanding of semiconductor materials and fabrication processes.
• Experience developing and executing DOE.
• Experience with SPC and data-driven optimization.
• Experience qualifying process equipment and implementing improvements.
• Strong analytical, troubleshooting, and communication skills.

Responsabilidades

• Develop, optimize, and sustain CMP processes.
• Design and execute DOE to improve capability and yield.
• Qualify new equipment, materials, and process changes.
• Monitor process performance and implement corrective actions to reduce defects.
• Utilize SPC methodologies to maintain process health.
• Analyze process data and prepare technical reports and recommendations.
• Partner with Process Integration, Equipment Engineering, and Metrology teams.
• Drive continuous improvement for throughput, yield, and reliability.
• Maintain ownership of assigned CMP equipment and long-term roadmaps.

Conocimientos

CMP experience

DOE

SPC

Data analysis

Communication

Educación

Bachelor's degree (Engineering/Materials/C Chemistry/Physics)

Herramientas

Process equipment qualification

Descripción del empleo

Position Summary

Quantum Computing Inc. (QCi) NHanced Semiconductors is seeking an experienced Chemical Mechanical Planarization (CMP) Engineer to support process development and manufacturing operations within our advanced semiconductor packaging environment. This role will be responsible for developing and optimizing CMP processes, executing design of experiments (DOE), qualifying equipment, improving yields, and reducing process defects.

The ideal candidate will bring hands-on CMP experience and a strong understanding of semiconductor manufacturing processes. This individual will collaborate closely with Process Integration, Equipment Engineering, and Metrology teams to drive process performance and support the growth of NHanced's expanding semiconductor operations.

Key Responsibilities

• Develop, optimize, and sustain Chemical Mechanical Planarization (CMP) processes.
• Design and execute experiments (DOE) to improve process capability, yield, and performance.
• Qualify new equipment, materials, and process changes.
• Monitor process performance and implement corrective actions to reduce defects and variability.
• Utilize Statistical Process Control (SPC) methodologies to maintain process health.
• Analyze process data and prepare technical reports and recommendations.
• Partner with Process Integration, Equipment Engineering, and Metrology teams to support product and technology development.
• Drive continuous improvement initiatives related to throughput, yield, and process reliability.
• Maintain ownership of assigned CMP equipment and support long‑term process roadmap initiatives.

Qualifications

Required

• Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or a related technical discipline.
• Minimum of 3 years of direct Chemical Mechanical Planarization (CMP) experience in a semiconductor manufacturing environment.
• Strong understanding of semiconductor materials and fabrication processes.
• Experience developing and executing Design of Experiments (DOE).
• Experience with Statistical Process Control (SPC) and data-driven process optimization.
• Experience qualifying process equipment and implementing process improvements.
• Strong analytical, troubleshooting, and problem‑solving skills.
• Excellent communication and collaboration abilities.

Preferred

• Experience supporting advanced packaging technologies.
• Knowledge of Through‑Silicon Via (TSV) processing.
• Knowledge of Redistribution Layer (RDL) technologies.
• Experience working in high‑volume semiconductor manufacturing environments.
• Experience with root cause analysis and yield improvement initiatives.
• Experience collaborating with Process Integration, Equipment Engineering, or Metrology teams.

Why Join Us?

• Be a foundational member of a growing CMP organization.
• Support a rapidly expanding semiconductor manufacturing site with significant planned growth initiatives.
• Work on advanced semiconductor packaging technologies alongside a multidisciplinary engineering team.
• Gain opportunities for career growth into technical leadership, people leadership, or process integration engineering roles.
• Full‑time onsite position located in Odon, Indiana.
• Work performed in a semiconductor cleanroom environment.
• Requires the use of cleanroom garments and personal protective equipment.
• May occasionally lift and transport wafer carriers and related materials.

Quantum Computing Inc. (QCi) is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or any other characteristic protected by applicable federal, state, or local law.

Incumbent(s) in this position may be required to perform other duties and special assignments not specifically stated above. Statements outlined in this section are designated as essential job functions in accordance with the Americans with Disabilities Act of 1990.