Associate Director, Engineering – Microelectronics

Jobtailor; California (MO); On-site; USD 180,000 - 230,000; Full time

Job summary

Raytheon seeks a senior technologist to lead development of a microelectronics packaging portfolio using 2.5D and 3D integration to increase RF/mixed-signal density. You will guide program capture and execution of CR&D efforts across the Raytheon enterprise and identify strategic opportunities with senior leadership.

Role requires extensive experience in packaging, cross-functional leadership, and strong customer engagement with the ability to travel.

Qualifications

• Bachelor's degree in STEM required.
• 12+ years of relevant experience in microelectronics packaging.
• Experience writing or leading responses to solicitations (RFIs/RFPs).
• Experience managing program cost, schedule, and technical performance.
• Ability to lead cross-functional teams across engineering, contracts, finance, procurement, and manufacturing.
• Active Top Secret clearance required; ability to obtain TS/SCI after start; U.S. citizenship required.
• Experience with 2.5D/3D microfabrication and interposer fabrication.
• Knowledge of government acquisition processes and DARPA/Intelligence Community work.

Responsibilities

• Develop strategy and lead development of a microelectronics packaging portfolio.
• Provide technical direction during new program capture and execution of CR&D programs.
• Support maturation and transition of technologies into operational programs.
• Identify strategic product opportunities and propose IRAD projects.
• Lead capture and management of resulting projects.
• Conduct customer interactions to develop opportunities, white papers, and proposals.
• Align program teams to customer priorities through requirements and mission analysis.
• Lead trade studies for 2.5D/3D integration architectures and interposer fabrication.
• Guide, mentor, and train employees across RF, mixed-signal, system integration, and packaging domains.
• Manage and report portfolio investment budget; travel for customer engagements.

Skills

Microelectronics Packaging

2.5D Integration

3D Integration

RF System Design

Mixed-Signal Systems

Program Management

Cross-Functional Leadership

Customer Interaction

Communication Skills

Mentoring

Team Collaboration

Risk Mitigation

IRAD / DOE Capture

Security Clearance (TS/SCI potential)

Education

Bachelor's degree in STEM

MS or PhD in related engineering (preferred)

Job description

• Develop strategy and lead development of a microelectronics packaging portfolio using 2.5D and 3D heterogeneous integration to increase functional density of RF and mixed-signal subsystems
• Provide technical direction and expertise during new program capture and execution of Contract Research and Development programs
• Support maturation and transition of technologies into operational programs across the Raytheon enterprise
• Identify strategic product development opportunities and propose and coordinate IRAD projects across programs and product lines
• Develop new business capture strategies with senior leadership and integrated functional teams
• Lead capture and management of resulting projects
• Conduct customer interactions to develop strategic and emerging microelectronics packaging opportunities, white papers, and proposals
• Align program teams to customer priorities through requirements development, mission analysis, shaping, and pre-design
• Actively manage risk mitigation strategies and capture program opportunities
• Lead trade studies for 2.5D and 3D integration strategies using monolithic and chiplet-based architectures
• Lead and manage interposer fabrication and assembly strategy across Raytheon manufacturing sites and third-party suppliers
• Lead technical white papers and proposal volumes through cross-organizational collaboration
• Guide, apprentice, mentor, and train employees across RF, mixed-signal, system integration, and packaging domains
• Manage and report portfolio investment budget
• Travel for customer engagements

Requirements

• Bachelor's degree in Science, Technology, Engineering, or Mathematics (STEM)
• Minimum of 12 years of prior relevant experience
• Experience with microelectronics design and development, emphasizing microelectronics packaging
• Experience writing and/or leading responses to solicitations, including RFIs, RFPs, white papers, and/or proposals
• Experience managing program cost, schedule, and technical performance
• Experience leading cross-functional teams including engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations
• Active and transferable Top Secret U.S. government-issued security clearance required prior to start date
• Ability to obtain a Top Secret/SCI clearance and/or program access after start
• U.S. citizenship required because only U.S. citizens are eligible for a security clearance
• Experience in high-performance RF system design and high-performance mixed-signal systems
• Expert knowledge of electrical, mechanical, and thermal microelectronics packaging constraints
• Experience with state-of-the-art 2.5D and 3D microfabrication and assembly techniques
• Experience across the full product development lifecycle
• Demonstrated excellence interacting with customers and decision makers
• Excellent verbal, written, and presentation communication ability
• Knowledge of Department of War and Intelligence Community operational concepts
• Experience capturing and executing programs within Department of War and Intelligence Community Science and Technology organizations, including DARPA and service laboratories
• Familiarity with the government acquisition process
• 5+ years of experience successfully managing technology development programs and IRAD projects
• Ability to prioritize and manage a high-mix workload involving multiple projects
• Ability to obtain Program Management (Level 4) and EV Certification
• Advanced degree such as MS or PhD in a related engineering field (preferred)
• Ability to travel for customer engagements

Core Competencies

Demonstrates expertise in microelectronics packaging, including 2.5D and 3D integration strategies, while effectively managing cross-functional teams and customer engagements. Proven ability to develop and execute strategic business capture initiatives and manage program performance within the Department of War and Intelligence Community.

Highest-signal resume keywords

• Microelectronics Packaging
• 2.5D And 3D Integration
• Program Management
• Cross-Functional Team Leadership
• Top Secret U.S. Government Security Clearance

ATS Optimization Keywords

Hard Skills

• Microelectronics Design
• RF System Design
• Mixed-Signal Systems
• Program Cost Management
• Technical Performance Management
• Proposal Writing
• Risk Mitigation Strategies
• Product Development Lifecycle
• Microfabrication Techniques
• Interposer Fabrication

Soft Skills

• Customer Interaction
• Communication Ability
• Mentoring
• Team Collaboration
• Prioritization

Certifications & Qualifications

• Program Management (Level 4)
• EV Certification

Industry Keywords

• Department of War
• Intelligence Community
• DARPA
• Science And Technology Organizations
• Government Acquisition Process