AI Memory Architect for Next-Gen AI Systems

Micron Technology; Richardson (TX); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical plans

Paid time off

Holidays

Benefit programs

Job summary

Micron Technology in Richardson, TX, seeks an AI Infrastructure & HBM Architecture Engineer pursuing a Master’s or PhD to explore next‑generation AI memory and system environments. You will analyze data, model performance, and contribute to tool development that informs HBM decisions.

You will work with DTPCO, Design, and Product/System teams, gaining hands‑on exposure to how AI workloads influence memory system design and intercept strategies.

Qualifications

• Pursuing a Master’s degree or PhD in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• Strong foundation in computer architecture, digital systems, and hardware/software interaction.
• Interest in memory subsystem design (HBM, DDR) and its impact on AI/ML workloads.
• Deep understanding of LLM pipelines and bottlenecks.
• Programming experience in Python, C/C++, or similar languages.

Responsibilities

• Research emerging trends in compute, networking, and storage to anticipate AI workload evolution.
• Support HBM architecture analysis by collecting data on bandwidth, latency, and system memory needs.
• Help develop/refine simulation frameworks for modeling AI cluster performance and memory behavior.
• Assist in first‑order models for HBM bandwidth, latency, CPU/GPU interactions, and memory hierarchy trade‑offs.
• Build trend dashboards using CSP benchmarks and industry datasets.
• Collaborate with DTPCO mentors to explore architectural intercept opportunities for next‑gen AI systems.

Skills

Python

C/C++

Computer Architecture

Memory Systems

LLM Bottlenecks

Data Analysis

Education

MS/PhD in EE/CE/CS

Tools

Simulation Frameworks

Benchmarking Tools

Job description

Micron Technology in Richardson, TX, seeks an AI Infrastructure & HBM Architecture Engineer pursuing a Master’s or PhD to explore next‑generation AI memory and system environments. You will analyze data, model performance, and contribute to tool development that informs HBM decisions.

You will work with DTPCO, Design, and Product/System teams, gaining hands‑on exposure to how AI workloads influence memory system design and intercept strategies.