HBM Memory Design Intern: AI-Driven Innovation

Micron Technology, Inc.

Richardson (TX)

On-site

USD 120,000 - 180,000

Full time

12 days ago
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Medical, dental and vision plans
Paid time-off
Paid holidays

Job summary

Micron Technology, Inc. in Richardson, TX is seeking an HBM Memory Design Engineer to design, analyze, and optimize memory and analog circuits for next‑gen DRAM, including collaboration with global teams to meet reliability and performance objectives.

You will use AI-Assisted tools to enhance design productivity and participate in production ramps with cross-functional teams across layout, verification, and product engineering.

Qualifications

  • Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related technical field.
  • Experience with schematic entry and circuit simulation tools such as FineSim and/or HSPICE.
  • Familiarity with Verilog modeling, simulation environments, power network analysis, and state machine logic.
  • Experience with scripting languages such as Python, TCL, or Perl and strong analytical problem-solving skills.

Responsibilities

  • Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities.
  • Perform circuit verification, parasitic modeling, and design simulations using industry-standard tools to ensure performance and reliability targets are achieved.
  • Collaborate with layout, CAD, modeling, verification, and multi-functional engineering teams to meet floor planning, routing, manufacturability, and quality objectives.
  • Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing teams to support product development and successful production ramps.
  • Leverage AI-Assisted tools and AI-Enabled workflows to improve design efficiency, accelerate analysis, and support data-driven engineering decisions.

Skills

CMOS circuit design
Schematic entry
Circuit simulation
Verilog modeling
Python scripting
TCL scripting
Perl scripting
Analytical problem solving

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Tools

FineSim
HSPICE

Job description

Micron Technology, Inc. in Richardson, TX is seeking an HBM Memory Design Engineer to design, analyze, and optimize memory and analog circuits for next‑gen DRAM, including collaboration with global teams to meet reliability and performance objectives.

You will use AI-Assisted tools to enhance design productivity and participate in production ramps with cross-functional teams across layout, verification, and product engineering.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

HBM Design Architect – AI-Driven Memory Innovation
HBM Design Architect – AI-Driven Memory Innovation

Micron Technology, Inc. • Richardson (TX)

On-site
USD 90,000 - 130,000
Medical, dental and vision plans
Robust paid time-off
Paid holidays
+1
HBM Design Engineer Intern - AI-Driven Memory
HBM Design Engineer Intern - AI-Driven Memory

Micron Technology • Richardson (TX)

On-site
USD 34,000 - 55,000
HBM Memory Design Architect: Innovate at AI Frontiers
HBM Memory Design Architect: Innovate at AI Frontiers

Micron Technology • Richardson (TX)

On-site
USD 97,000 - 205,000
Medical, dental and vision plans
Paid time off
Paid holidays
HBM Memory Design Engineer — Innovate Next-Gen Memory
HBM Memory Design Engineer — Innovate Next-Gen Memory

Micron Memory Malaysia Sdn Bhd • Richardson (TX)

On-site
USD 75,000 - 110,000
Medical, dental and vision plans
Paid time off
Paid holidays
HBM Memory Design Engineer – AI/ML Silicon Innovator
HBM Memory Design Engineer – AI/ML Silicon Innovator

Micron Technology • Richardson (TX)

On-site
USD 120,000 - 170,000
Senior HBM Memory Architect for AI/ML Systems
Senior HBM Memory Architect for AI/ML Systems

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 160,000
Medical insurance
Dental insurance
Vision insurance
+3
Senior HBM Memory Architect for AI-Driven Design
Senior HBM Memory Architect for AI-Driven Design

Micron Technology • Folsom (CA)

On-site
USD 97,000 - 205,000
Medical insurance
Dental insurance
Vision plans
+4
Lead HBM Memory Architect for Next-Gen AI/ML
Lead HBM Memory Architect for Next-Gen AI/ML

Micron Memory Malaysia Sdn Bhd • Richardson (TX)

On-site
USD 180,000 - 230,000
Senior HBM Design Architect — Memory for AI and HPC
Senior HBM Design Architect — Memory for AI and HPC

Micron Memory Malaysia Sdn Bhd • Richardson (TX)

On-site
USD 146,000 - 297,000
HBM Design Engineer Intern: AI-Enabled Chip Design
HBM Design Engineer Intern: AI-Enabled Chip Design

Micron Technology, Inc. • Richardson (TX)

On-site
USD 34,000 - 48,000