Advanced Packaging Technician: Data-Driven Manufacturing

Intel; Phoenix (AZ); On-site; USD 60,000 - 85,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel in Phoenix, Arizona, is seeking a Manufacturing Technician within the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) group. The role centers on substrate production, equipment data analysis, and ongoing process optimization to ensure quality and efficiency.

You will perform setup, calibration, preventive maintenance, and data collection in collaboration with Module Engineering to implement configuration changes and support continuous improvement.

Qualifications

• STEM Certification or degree required.
• Associate degree STEM with 1+ year experience or Bachelor's in STEM.
• 3+ years related experience in manufacturing or military can substitute for a degree.
• Willingness to lift 25 pounds per shift, climb ladders 1–3 times per shift, and wear respirator when required.

Responsibilities

• Collect and evaluate operating data to optimize processes.
• Lead improvements, address nonstandard events, and maintain system health.
• Update training manuals and participate in safety forums and Emergency Response Team activities.

Education

STEM Certification

Associate degree STEM

Bachelor's degree STEM

3+ years manufacturing/military experience

Job description

Intel in Phoenix, Arizona, is seeking a Manufacturing Technician within the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) group. The role centers on substrate production, equipment data analysis, and ongoing process optimization to ensure quality and efficiency.

You will perform setup, calibration, preventive maintenance, and data collection in collaboration with Module Engineering to implement configuration changes and support continuous improvement.