Advanced Packaging Technician: Substrate & Wafer Assembly

Intel Corporation; Chandler (AZ); On-site; USD 60,000 - 85,000; Full time

Benefits offered by this job

Health insurance

Stock bonuses

Retirement plan

Vacation

Job summary

Intel Corporation in the United States (Arizona) is seeking a Manufacturing Technician for the Advanced Packaging Technology Development (APTDSWA) organization. You will contribute to substrate production, equipment operation, data analysis, and ongoing process improvements in a high‑tech semiconductor manufacturing environment.

The role involves preventive maintenance, troubleshooting, and maintaining training manuals, with emphasis on safety and team collaboration.

Qualifications

• Must meet STEM-related minimum qualifications or higher.
• Lift 25 pounds occasionally and climb ladders.
• Ready to work in a fast-paced semiconductor manufacturing environment.

Responsibilities

• Operate and monitor substrate production processes.
• Perform preventive maintenance and troubleshoot equipment.
• Lead improvement initiatives and document training procedures.
• Maintain safety and compliance within the production line.

Skills

Adaptability

Judgment

Independence

Safety awareness

Education

Associate degree STEM Related

Bachelor's degree STEM

Job description

Intel Corporation in the United States (Arizona) is seeking a Manufacturing Technician for the Advanced Packaging Technology Development (APTDSWA) organization. You will contribute to substrate production, equipment operation, data analysis, and ongoing process improvements in a high‑tech semiconductor manufacturing environment.

The role involves preventive maintenance, troubleshooting, and maintaining training manuals, with emphasis on safety and team collaboration.