Advanced Packaging Materials Engineer

Intel; Hillsboro (OR); On-site; USD 115,000 - 220,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Vacation

Job summary

Intel in Hillsboro, Oregon seeks a highly motivated materials scientist/engineer to join Materials Technology Development. You will leverage DOE and data analysis to drive packaging materials, processes and equipment improvements supporting Intel’s advanced packaging roadmap.

Ideal candidates hold a materials-oriented degree with hands-on experience in packaging module development, design of experiments, and collaboration across suppliers and manufacturing. Onsite work is required.

Qualifications

• Bachelor's degree with 4+ years of experience or Master's with 3+ years or Ph.D in a relevant field.
• 4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.
• Experience collaborating with cross-functional teams, suppliers, and manufacturing operations.

Responsibilities

• Develops assembly materials, processes and/or equipment for Intel's future packaging platforms.
• Optimizes manufacturing efficiency and improves materials, processes to meet quality, reliability, cost and yield targets.
• Defines process and equipment specs using DOE and data analysis; documents improvements.
• Sets material specs for contract assemblers and vendors; collaborates with supplier quality and procurement.
• Develops new techniques, tools, and quality screens to identify material issues early.
• Leads innovations in materials, equipment and processes using experimental design and statistics.
• Provides consultation on packaging problems and responses to customer requests.

Skills

DOE principles

Statistical analysis

Packaging fundamentals

Cross-functional collaboration

Materials characterization

Education

Bachelor's degree in Materials Science/Metallurgy/Engineering

Master's degree in related field

Ph.D in a relevant discipline

Job description

Intel in Hillsboro, Oregon seeks a highly motivated materials scientist/engineer to join Materials Technology Development. You will leverage DOE and data analysis to drive packaging materials, processes and equipment improvements supporting Intel’s advanced packaging roadmap.

Ideal candidates hold a materials-oriented degree with hands-on experience in packaging module development, design of experiments, and collaboration across suppliers and manufacturing. Onsite work is required.