Advanced Microelectronics Packaging Engineer

Saic; Town of Texas (WI); On-site; USD 110,000 - 190,000; Full time

Job summary

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems.

The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.

Qualifications

• Bachelor's degree in Mechanical or Aerospace Engineering.
• Two candidates at different levels: 3+ years experience in mechanical modeling and simulation; 10+ years experience in mechanical modeling and simulation.
• Experience with or knowledge of systems engineering principles.
• Interim secret clearance required to start with ability to obtain a secret clearance (SAIC will sponsor).
• Must be a US citizen.

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly.
• Perform mechanical modeling and simulation activities, including FEA, thermal fatigue, shock and vibration analysis, and MATLAB-based modeling.
• Apply systems engineering principles throughout the product lifecycle, including requirement development, verification, and validation.
• Participate in Systems Engineering Technical Reviews (SRR, PDR, CDR, PRR).
• Collaborate with design teams to document design development activities.
• Support TIMs and cross-functional team discussions.
• Analyze solder interconnect technologies (BGA, CGA, Flip-Chip, J-lead).
• Conduct experimental test and evaluation activities (solder fatigue, material properties).
• Clearly communicate technical findings to diverse audiences.

Skills

FEA/ANSYS

MATLAB

Vibration & Shock

Thermal Fatigue

Systems Engineering Principles

Communication of Technical Findings

Education

Bachelor's degree in Mechanical or Aerospace Engineering

Tools

ANSYS

MATLAB

Job description

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems.

The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.