Advanced Microelectronics Packaging Engineer

SAIC; Crane (IN); On-site; USD 110,000 - 170,000; Full time

Job summary

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

Responsibilities include mechanical design/analysis, FEA/ MATLAB modeling, systems engineering throughout the lifecycle, and participation in SRR, PDR, CDR, and PRR reviews.

Qualifications

• Bachelor's degree in Mechanical or Aerospace Engineering is required.
• Experience with mechanical modeling and simulation (FEA/ANSYS, MATLAB) is required.
• Interim secret clearance to start with ability to obtain secret clearance; US citizenship is required.

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly.
• Perform mechanical modeling and simulation activities, including FEA, thermal fatigue, shock and vibration analysis, and MATLAB-based modeling.
• Apply systems engineering principles across the product lifecycle: requirement development, verification, and validation.
• Participate in and support Systems Engineering Technical Reviews (SRR, PDR, CDR, PRR).
• Collaborate with design teams to document development activities and communicate findings to stakeholders.
• Analyze solder interconnect technologies (BGA, CGA, Flip-Chip, J-lead) and perform test/evaluation activities.

Skills

Mechanical modeling

FEM/ANSYS

MATLAB

Systems engineering

US citizenship

Education

Bachelor's degree in Mechanical or Aerospace Engineering

Tools

ANSYS

MATLAB

Job description

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

Responsibilities include mechanical design/analysis, FEA/ MATLAB modeling, systems engineering throughout the lifecycle, and participation in SRR, PDR, CDR, and PRR reviews.