Advanced Packaging Engineer

Saic; Town of Texas (WI); On-site; USD 110,000 - 190,000; Full time

Job summary

SAIC is seeking an Advanced Packaging Engineer to support missile system hardware design and analysis. You will collaborate with multidisciplinary teams to develop and validate advanced microelectronics packaging solutions for complex defense systems.

The role involves mechanical modeling, finite element analysis, thermal fatigue, and systems engineering across the lifecycle, with opportunities for growth and security clearances.

Qualifications

• Bachelor's degree in Mechanical or Aerospace Engineering.
• Two candidates at different levels: 3+ years experience in mechanical modeling and simulation; 10+ years experience in mechanical modeling and simulation.
• Experience with or knowledge of systems engineering principles.
• Interim secret clearance required to start with ability to obtain a secret clearance (SAIC will sponsor).
• Must be a US citizen.

Responsibilities

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly.
• Perform mechanical modeling and simulation activities, including FEA, thermal fatigue, shock and vibration analysis, and MATLAB-based modeling.
• Apply systems engineering principles throughout the product lifecycle, including requirement development, verification, and validation.
• Participate in Systems Engineering Technical Reviews (SRR, PDR, CDR, PRR).
• Collaborate with design teams to document design development activities.
• Support TIMs and cross-functional team discussions.
• Analyze solder interconnect technologies (BGA, CGA, Flip-Chip, J-lead).
• Conduct experimental test and evaluation activities (solder fatigue, material properties).
• Clearly communicate technical findings to diverse audiences.

Skills

FEA/ANSYS

MATLAB

Vibration & Shock

Thermal Fatigue

Systems Engineering Principles

Communication of Technical Findings

Education

Bachelor's degree in Mechanical or Aerospace Engineering

Tools

ANSYS

MATLAB

Job description

Description

SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems.

JOB RESPONSIBILITES:

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary
• Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
• Collaborate with design teams to facilitate and document design development activities
• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

• Bachelor's degree in Mechanical or Aerospace Engineering
• We are looking to hire two candidates at different levels:
  • 3+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
  • 10+ years experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• Experience with or knowledge of systems engineering principles
• Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process
• Must be a US citizen

PREFERRED EXPERIENCE:

• Experience with missile system hardware design and analysis
• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies