Electronics Packaging Engineer for Defense Tech

Johns Hopkins Applied Physics Laboratory; Laurel (MD); On-site; USD 100,000 - 245,000; Full time

Job summary

The Johns Hopkins Applied Physics Laboratory (APL) seeks an Electronics Packaging Engineer to lead the design of electromechanical hardware from concept through delivery. You will perform thermal and structural analyses, drive detailed design, assembly, and testing, collaborating with engineers across mission areas.

You will help deliver robust mechanical solutions in a fast-paced environment, mentor junior team members, and participate in design reviews while supporting travel and potential

Qualifications

• Bachelor's of Science in Mechanical Engineering, Aerospace Engineering or related discipline.
• 5+ years of experience in mechanical engineering.
• Experience with full product development lifecycle, including design, structural/thermal analysis, and integration.
• Familiarity with CAD and CAE software (CREO, SolidWorks, ANSYS, FEMAP, etc).

Responsibilities

• Lead the design effort of electromechanical hardware from concept thru delivery.
• Perform thermal and structural analysis to validate designs.
• Develop robust mechanical solutions and coordinate cross-functional reviews.
• Mentor junior members of the team and participate in team meetings.

Skills

Mechanical Engineering

Aerospace Engineering

Security clearance eligibility

Leadership

Education

Bachelor's in Mechanical/Aerospace Engineering

Tools

CREO

SolidWorks

ANSYS

FEMAP

Job description

The Johns Hopkins Applied Physics Laboratory (APL) seeks an Electronics Packaging Engineer to lead the design of electromechanical hardware from concept through delivery. You will perform thermal and structural analyses, drive detailed design, assembly, and testing, collaborating with engineers across mission areas.

You will help deliver robust mechanical solutions in a fast-paced environment, mentor junior team members, and participate in design reviews while supporting travel and potential