Senior Microelectronics Packaging Engineer - Hybrid Role

D.O.M. magazine; Northern (KY); Hybrid; USD 86,000 - 147,000; Full time

Benefits offered by this job

Health insurance

401(k) savings plan

Disability coverage

Life and accident insurance

Paid time off

Paid holidays

Parental leave

Military leave

Bereavement leave

Discounts on home/auto/pet insurance

Job summary

BAE Systems is seeking an experienced Mechanical Engineer for Microelectronics Packaging in Cedar Rapids, IA. The role blends onsite and remote work, supporting design, development, and manufacturing of next-generation GPS-related packages.

Responsibilities span from concept to factory support; requires a Bachelor’s in Engineering and 4+ years in microelectronics packaging, with a DoD clearance in scope.

Qualifications

• Bachelor's degree in Engineering with focus on Mechanical, Aerospace or Material Engineering.
• 4+ years of direct microelectronics packaging experience or equivalent.
• Ability to obtain DoD security clearance.

Responsibilities

• Contribute to program pursuits and bid estimates.
• Participate in microelectronics product development: packaging concept and board design.
• Develop technologies for next-generation packages.
• Coordinate prototype builds and evaluation.
• Conduct failure analysis for microelectronics packages.
• Support factory transition and provide manufacturing support.

Skills

4+ years microelectronics packaging

Bachelor's degree in Mechanical/Aerosb

Education

Bachelor's degree in Engineering (Mechanical, Aerospace or Material)

Tools

Microelectronics packaging development

Job description

BAE Systems is seeking an experienced Mechanical Engineer for Microelectronics Packaging in Cedar Rapids, IA. The role blends onsite and remote work, supporting design, development, and manufacturing of next-generation GPS-related packages.

Responsibilities span from concept to factory support; requires a Bachelor’s in Engineering and 4+ years in microelectronics packaging, with a DoD clearance in scope.