ADK Development Engineer: 2.5D/3D Packaging & Chiplet Design

Rapidus Corporation US; Santa Clara (CA); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Shape next-gen packaging ecosystem

Collaboration with US/Japan teams

Competitive compensation and benefits

Fast-moving, innovative culture

Job summary

Rapidus Corporation US is seeking an ADK Development Engineer to lead creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet architectures and heterogeneous integration. You will collaborate across global sites with packaging R&D, process, EDA vendors, IP partners, and customer teams.

In this role you will focus on Synthesis and PnR implementation of the digital reference flow, drive adoption of AI/ML-driven design space

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field.
• 5+ years of experience in advanced packaging, 3DIC, package design, or design enablement.
• Strong knowledge of: 2.5D/3D packaging technologies (interposers, chiplets, hybrid bonding, TSV, RDL).
• DRC/LVS rule development and verification.
• Hands-on scripting experience (Python, Tcl, SKILL, etc.) for automation.
• Understanding of SI/PI/thermal analysis methodologies.
• Excellent communication skills and ability to work with cross-functional global teams.],
• ],
• job_responsibilities_description:[
• Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
• Package assembly rules
• Thermal/mechanical design guidelines
• Multi-die floorplanning and connectivity models
• Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
• Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
• Parasitic extraction and signal/power integrity analysis
• Validate ADK quality through:
• Automated regression testing
• Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
• Support customer design teams by providing technical guidance, documentation, and issue resolution.
• Drive continuous improvement of ADK architecture, automation, and release processes.

Responsibilities

• Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
• Package assembly rules
• Thermal/mechanical design guidelines
• Multi-die floorplanning and connectivity models
• Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
• Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
• Parasitic extraction and signal/power integrity analysis
• Validate ADK quality through automated regression testing.
• Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
• Support customer design teams with technical guidance, documentation, and issue resolution.
• Drive continuous improvement of ADK architecture, automation, and release processes.

Skills

Advanced packaging

3DIC

Package design

Design enablement

Scripting languages (Python, Tcl, SKIL

SI/PI/thermal analysis

Communication

Education

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field

Tools

Cadence

Synopsys

Siemens

Job description

Rapidus Corporation US is seeking an ADK Development Engineer to lead creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet architectures and heterogeneous integration. You will collaborate across global sites with packaging R&D, process, EDA vendors, IP partners, and customer teams.

In this role you will focus on Synthesis and PnR implementation of the digital reference flow, drive adoption of AI/ML-driven design space