Senior Assembly Design Kit (ADK) Development Engineer (2.5D/3D Advanced Packaging)

Rapidus Corporation US; Santa Clara (CA); In loco; USD 180.000 - 240.000; Tempo pieno

Vantaggi offerti da questo lavoro

Shape next-gen packaging ecosystem

Collaboration with US/Japan teams

Competitive compensation and benefits

Fast-moving, innovative culture

Descrizione del lavoro

Rapidus Corporation US is seeking an ADK Development Engineer to lead creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet architectures and heterogeneous integration. You will collaborate across global sites with packaging R&D, process, EDA vendors, IP partners, and customer teams.

In this role you will focus on Synthesis and PnR implementation of the digital reference flow, drive adoption of AI/ML-driven design space

Competenze

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field.
• 5+ years of experience in advanced packaging, 3DIC, package design, or design enablement.
• Strong knowledge of: 2.5D/3D packaging technologies (interposers, chiplets, hybrid bonding, TSV, RDL).
• DRC/LVS rule development and verification.
• Hands-on scripting experience (Python, Tcl, SKILL, etc.) for automation.
• Understanding of SI/PI/thermal analysis methodologies.
• Excellent communication skills and ability to work with cross-functional global teams.],
• ],
• job_responsibilities_description:[
• Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
• Package assembly rules
• Thermal/mechanical design guidelines
• Multi-die floorplanning and connectivity models
• Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
• Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
• Parasitic extraction and signal/power integrity analysis
• Validate ADK quality through:
• Automated regression testing
• Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
• Support customer design teams by providing technical guidance, documentation, and issue resolution.
• Drive continuous improvement of ADK architecture, automation, and release processes.

Mansioni

• Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
• Package assembly rules
• Thermal/mechanical design guidelines
• Multi-die floorplanning and connectivity models
• Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
• Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
• Parasitic extraction and signal/power integrity analysis
• Validate ADK quality through automated regression testing.
• Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
• Support customer design teams with technical guidance, documentation, and issue resolution.
• Drive continuous improvement of ADK architecture, automation, and release processes.

Conoscenze

Advanced packaging

3DIC

Package design

Design enablement

Scripting languages (Python, Tcl, SKIL

SI/PI/thermal analysis

Communication

Formazione

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field

Strumenti

Cadence

Synopsys

Siemens

Descrizione del lavoro

We are seeking a highly skilled ADK (Assembly Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging, including chiplet-based architectures, silicon interposers, and heterogeneous integration technologies. This role is central to enabling next‑generation multi‑die systems by delivering robust ADKs that bridge design, manufacturing, and EDA ecosystems.

You will collaborate closely with packaging R&D, process integration, EDA vendors, IP partners, and customer design teams across multiple global sites.

Locations: Albany, NY (USA) / Santa Clara, CA (USA) / Tokyo (Japan) / Chitose (Japan)

Employment Type: Full-time

Department: Design Enablement / Advanced Packaging Technology

About Rapidus

Rapidus Corporation, founded in 2022, is Japan-led initiative to build a world-class advanced logic semiconductor foundry. With a bold vision to accelerate innovation, we are pioneering cutting‑edge logic semiconductor research, development, design, and manufacturing to transform the global semiconductor industry.

Why Join Us

You will play a central leadership role in building the world’s most advanced 2nm and next‑generation enablement ecosystem, shaping the foundation for future semiconductor innovation.

You will focus on the implementation stages (Synthesis and PnR) of the digital reference flow. Additionally, you will lead the adoption of next‑generation automation tools, including AI/ML-driven DSE (Design space exploration)

Key Responsibilities

• Develop and maintain Assembly Design Kits (ADKs) for 2.5D/3D packaging technologies, including:
• Package assembly rules
• Thermal/mechanical design guidelines
• Multi-die floorplanning and connectivity models
• Define and implement design methodologies for chiplet-based and heterogeneous integration flows.
• Work with EDA vendors (Cadence, Synopsys, Siemens) to enable:
• Parasitic extraction and signal/power integrity analysis
• Validate ADK quality through:
• Automated regression testing
• Collaborate with process and packaging engineering teams to translate manufacturing constraints into design rules.
• Support customer design teams by providing technical guidance, documentation, and issue resolution.
• Drive continuous improvement of ADK architecture, automation, and release processes.

Required Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Materials Science, or related field.
• 5+ years of experience in advanced packaging, 3DIC, package design, or design enablement.
• Strong knowledge of:
• 2.5D/3D packaging technologies (interposers, chiplets, hybrid bonding, TSV, RDL)
• DRC/LVS rule development and verification
• Hands‑on experience with scripting languages (Python, Tcl, SKILL, etc.) for automation.
• Understanding of SI/PI/thermal analysis methodologies.
• Excellent communication skills and ability to work with cross‑functional global teams.

Preferred Qualifications

• Experience developing PDKs/ADKs or design kits for foundry or OSAT environments.
• Knowledge of heterogeneous integration standards (UCIe, BoW, HBM).
• Familiarity with chiplet architecture and multi‑die system design.
• Experience with packaging manufacturing processes (RDL, micro‑bump, hybrid bonding).
• Ability to lead technical discussions with customers and ecosystem partners.

What We Offer

• Opportunity to shape the design ecosystem for next‑generation 2.5D/3D semiconductor technologies.
• Collaboration with world‑class R&D teams across the US and Japan.
• Competitive compensation and benefits.
• A fast‑moving environment where innovation and technical leadership are valued.
• Comprehensive Health, Dental and Vision coverage, fully at company’s expense (no deductibles)