3DIC Wet & Plating Tech Lead for Advanced Packaging

Intel Corporation; Hillsboro (OR); Presencial; USD 181.000 - 255.000; Jornada completa

Descripción de la vacante

Intel Foundry is seeking a Wet and Plating Module Development Manager to lead Wet Etch/Clean and Plating technology development for 3DIC platforms. This role manages a team of process engineers while contributing technically to process optimization.

The successful candidate will shape the technology roadmap, drive production-ready processes for high-volume manufacturing, and collaborate across functions to enable manufacturing excellence and seamless technology transfer.

Formación

• 8+ years with a Masters or 6+ years with a PhD in a related field.
• Experience in Wet Etch/Clean or Plating and hands-on with related platforms.
• Strong project management and cross-functional collaboration.

Responsabilidades

• Lead and manage a team of engineers with clear goals and coaching.
• Formulate long-term process roadmaps for advanced packaging.
• Oversee development of production-worthy wet etch/plating processes.
• Foster talent and drive technical excellence in the team.
• Develop and track project schedules with cross-functional teams.
• Drive yield improvement and defect reduction programs.
• Partner with process integration and operations for tech transfer.

Conocimientos

Team leadership

Project management

Vendor relations

DOE principles

Problem-solving

Strategic thinking

Cross-functional collaboration

Educación

Master or PhD in Chemistry, Materials Science, Physics, Electrical Engineering or Mechanical Engineering

Descripción del empleo

Intel Foundry is seeking a Wet and Plating Module Development Manager to lead Wet Etch/Clean and Plating technology development for 3DIC platforms. This role manages a team of process engineers while contributing technically to process optimization.

The successful candidate will shape the technology roadmap, drive production-ready processes for high-volume manufacturing, and collaborate across functions to enable manufacturing excellence and seamless technology transfer.