Wet Etch Module Engineer: Pioneering 300mm Tech

Intel Corporation

Hillsboro (OR)

Ibrido

USD 134.000 - 189.000

Tempo pieno

4 giorni fa
Candidati tra i primi

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Vantaggi offerti da questo lavoro

Stock bonuses
Health insurance
Retirement plan
Relocation assistance

Descrizione del lavoro

Intel Foundry TD seeks a Wet Etch Module Development Engineer with a PhD in a related field to lead DOE-driven development of novel wet etch, cleaning, and surface treatment processes for next‑gen transistor architectures. You will collaborate with global suppliers and integrate CFD, kinetics modeling, and data science to accelerate discovery and yield improvements.

The role offers a hybrid work model, access to state‑of‑the‑art 300mm facilities, and opportunities to contribute to patentable IP

Competenze

  • Ph.D. required or expected within 12 months.
  • 2+ years hands-on experimental research in wet chemical synthesis/etching, electrochemistry, or cleanroom processing.
  • Strong knowledge of chemical kinetics and interfacial surface phenomena.

Mansioni

  • Design and execute DOEs to invent and validate wet etch and clean processes for advanced transistor architectures.
  • Collaborate with equipment suppliers to optimize single‑wafer and batch wet processing hardware.
  • Apply CFD, chemical kinetics, and data science to screen formulations and improve yields.
  • Translate chemical phenomena into patentable IP and proprietary wet processing solutions.
  • Scale lab processes to 300mm fab environments using CE methodologies.

Conoscenze

DOE proficiency
Wet etching
Surface chemistry
Python
MATLAB
JMP
Machine learning
Experimental research

Formazione

Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, Mechanical Engineering (Microfluidics/Transport Phenomena), Physics

Strumenti

Ellipsometry
AFM
SEM/TEM
XPS
FTIR
TXRF
ICP‑MS
Single‑wafer spin hardware

Descrizione del lavoro

Intel Foundry TD seeks a Wet Etch Module Development Engineer with a PhD in a related field to lead DOE-driven development of novel wet etch, cleaning, and surface treatment processes for next‑gen transistor architectures. You will collaborate with global suppliers and integrate CFD, kinetics modeling, and data science to accelerate discovery and yield improvements.

The role offers a hybrid work model, access to state‑of‑the‑art 300mm facilities, and opportunities to contribute to patentable IP

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