Wet Etch Module Architect for Next-Gen Semiconductors

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Relocation assistance

Stock bonuses

Health, retirement and vacation

Job summary

Intel Foundry TD seeks a Wet Etch Module Development Engineer with a Ph.D. in relevant fields to pioneer atomic-layer selective etching and advanced wet processes for next-generation transistor architectures.

You will design and execute DOE experiments, collaborate with equipment suppliers, and translate complex surface phenomena into scalable manufacturing solutions. Work will span from lab-scale coupon studies to 300mm fab deployment, leveraging CFD, kinetics modelling, and data science to

Qualifications

• Ph.D. in Chemical Engineering, Chemistry, Materials Science & Engineering, Electrochemistry, or related field (degree within 12 months).
• 2+ years hands-on experimental research in wet chemistry, etching, electrochemistry, or surface science.
• Experience with DOE, design of experiments, and robust data analysis.

Responsibilities

• Develop and execute wet etch and cleaning processes for next-gen transistor architectures.
• Collaborate with equipment suppliers to optimize single-wafer and batch wet processing.
• Apply CFD, kinetics modelling, and data analytics to improve yield.
• Document results and contribute to IP through patents/papers.

Skills

Design of experiments

Python

MATLAB

Machine learning

CFD

Education

Ph.D. in Chemical Engineering, Chemistry, Materials Science and Engineering, Electrochemistry, or related field

Tools

Ellipsometry

AFM

SEM

TEM

XPS

FTIR

TXRF

ICP-MS

Single-wafer spin hardware

Automated fluidic systems

Surface characterization

Job description

Intel Foundry TD seeks a Wet Etch Module Development Engineer with a Ph.D. in relevant fields to pioneer atomic-layer selective etching and advanced wet processes for next-generation transistor architectures.

You will design and execute DOE experiments, collaborate with equipment suppliers, and translate complex surface phenomena into scalable manufacturing solutions. Work will span from lab-scale coupon studies to 300mm fab deployment, leveraging CFD, kinetics modelling, and data science to