Avionics Packaging Mechanical Engineer

L3Harris Technologies; Palm Bay (FL); On-site; USD 100,000 - 140,000; Full time

Job summary

L3Harris Technologies in Palm Bay, FL seeks an Electronic Packaging / Mechanical Engineer to lead the mechanical design of Avionics assemblies from concept through qualification. You will collaborate with Designers, Thermal/Structural Analysts, and Programs Managers to deliver rugged electronics for defense applications.

The role emphasizes mechanical, electro-mechanical, and opto-mechanical design, with exposure to thermal, structural, and power analyses, and requires ability to obtain US

Qualifications

• Bachelors in engineering with 4+ years of related experience; graduate degree with 2+ years.
• In lieu of a degree, 8+ years of related experience.

Responsibilities

• Develop Avionics systems from concept to hardware integration and testing.
• Design complex mechanical layouts for multiple products.
• Package electrical components (cards, connectors, cables) for rugged environments.
• Support mechanical design, prototyping, testing, and troubleshooting.
• Interface with cross-functional teams and external vendors.

Skills

Mechanical design

3D CAD modeling

ASME Y14.5/GD&T

Electro-mechanical packaging

Military environment design

Education

Bachelor’s degree in engineering

Graduate degree (MS/PhD) in engineering

Tools

3D CAD: Creo/Catia/NX/SolidWorks

ASME Y14.5M-1994

Job description

L3Harris Technologies in Palm Bay, FL seeks an Electronic Packaging / Mechanical Engineer to lead the mechanical design of Avionics assemblies from concept through qualification. You will collaborate with Designers, Thermal/Structural Analysts, and Programs Managers to deliver rugged electronics for defense applications.

The role emphasizes mechanical, electro-mechanical, and opto-mechanical design, with exposure to thermal, structural, and power analyses, and requires ability to obtain US