Senior Electronics Packaging Lead Engineer (Defense)

Honeywell Aerospace US LLC in; Lansdale (Montgomery County); On-site; USD 123,000 - 154,000; Full time

Benefits offered by this job

Medical, dental, vision

Disability coverage

401(k) match

Educational assistance

Parental leave

Paid time off & holidays

Job summary

Honeywell Aerospace US LLC seeks a Senior Mechanical Design Engineer with a strong electronics packaging background for defense applications. You will lead packaging design, perform thermal and structural analyses, and work with cross-functional teams to ensure compliance with stringent military specifications.

You will mentor junior engineers, manage documentation, and stay ahead of emerging packaging technologies.

Qualifications

• Bachelor's degree in mechanical engineering or related field.
• At least 10 years of mechanical engineering experience with electronics packaging in the defense industry.
• Proficient in CAD (Creo) and simulation tools (ANSYS).
• Strong understanding of materials, thermal management and environmental protection for packaging.
• Familiarity with MIL-STD and defense-related regulations and standards.
• Excellent problem-solving, teamwork, and communication skills.
• Security clearance or eligibility for clearance is a plus.

Responsibilities

• Lead the design and development of electronics packaging solutions for harsh environments.
• Conduct thermal, vibration, and stress analyses to validate packaging designs.
• Collaborate with electrical engineers to integrate packaging with electronic components.
• Oversee prototyping, testing, and validation of packaging designs.
• Create and maintain detailed documentation for design processes and testing protocols.
• Mentor and provide technical guidance to junior engineers.

Skills

Mechanical design

Team collaboration

Documentation

Leadership

Education

Bachelor's degree in mechanical engineering

Tools

Creo CAD

ANSYS

Job description

Honeywell Aerospace US LLC seeks a Senior Mechanical Design Engineer with a strong electronics packaging background for defense applications. You will lead packaging design, perform thermal and structural analyses, and work with cross-functional teams to ensure compliance with stringent military specifications.

You will mentor junior engineers, manage documentation, and stay ahead of emerging packaging technologies.