Senior ElectroMechanical Packaging Engineer — 2D/3D

Lockheed Martin; Grand Prairie (TX); On-site; USD 85,000 - 158,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Flexible work arrangements

401(k) match

Job summary

Lockheed Martin Missiles and Fire Control seeks an ElectroMechanical Design Engineer to advance 2D/3D heterogeneous packaging concepts for aerospace and defense applications in Grand Prairie, TX or Orlando, FL. You will design, prototype and test packaging solutions alongside senior engineers.

The role emphasizes CREO/Windchill, hardware and packaging design, and mentoring junior engineers while contributing to TRL readiness and risk assessments for new packaging concepts.

Qualifications

• DoD Secret level clearance or ability to obtain one.
• Working knowledge of CREO and Windchill.
• Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis.
• Packaging design experience.
• Hardware design experience.
• Must be a U.S. citizen.

Responsibilities

• Conceiving and modeling 2D/3D package architectures that meet size, weight, power and reliability targets.
• Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
• Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
• Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
• Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
• Collaborating with cross functional teams to ensure seamless integration of packaging solutions into larger systems.
• Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
• Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
• Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.

Skills

DoD Secret clearance

CREO

Windchill

GD&T

Tolerance stack-up

Packaging design

Hardware design

U.S. citizen

Tools

Zuken E3

Mentor

Job description

Lockheed Martin Missiles and Fire Control seeks an ElectroMechanical Design Engineer to advance 2D/3D heterogeneous packaging concepts for aerospace and defense applications in Grand Prairie, TX or Orlando, FL. You will design, prototype and test packaging solutions alongside senior engineers.

The role emphasizes CREO/Windchill, hardware and packaging design, and mentoring junior engineers while contributing to TRL readiness and risk assessments for new packaging concepts.