3D IC Solutions Engineer – Package Design Engineer – EDA

Anysilicon; Wilsonville (OR); Híbrido; USD 120 000 - 190 000; Tempo integral

Resumo da oferta

Siemens EDA is seeking a package design lead to drive workflows for physical design planning, layout, and verification of cutting-edge 3D IC designs in an engineering leadership role.

You will manage floor/IO planning, interposer/substrate layout, and ensure package connectivity and DRC/DFM verification. Travel to client sites to validate workflows and support sales teams as needed.

Qualificações

• BS or MS in Electrical/Computer Engineering or equivalent.
• Advanced experience in package physical design and verification.

Responsabilidades

• Drive the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.
• Manage package floor planning, functional/IO planning, interposer/substrate planning, and layout.
• Oversee package level connectivity, LEC, and physical DRC/DFM verification of package components.
• Collaborate with 3D IC Solutions teams to integrate workflows into the 3D IC Physical Design process.
• Utilize reference designs and customer designs for workflow development, testing, and validation.
• Provide technical support to sales and marketing design service organizations as needed.
• Travel periodically to work with customers on workflow solutions.

Conhecimentos

Advanced packaging tools

Cadence APD/SiP

Siemens XSI/XPD

HyperLynx SI/PI

Redhawk Totem

Verilog LEF/DEF GDS OASIS

Windows/Linux

Python Tcl Perl

RTL to physical flow

DRC LVS IR/EM

Thermal/stress analysis tools

MS Office (Word/Excel/PP)

Formação académica

BS or MS in Electrical/Computer Engineering

Ferramentas

Cadence APD/SiP

Siemens XSI/XPD

HyperLynx SI/PI

Redhawk Totem

Verilog/LEF/DEF/GDS/OASIS

Descrição da oferta de emprego

Siemens EDA is a global leader in Electronic Design Automation, providing innovative solutions for electronic product development. We are looking for a motivated and experienced individual to join our 3D IC Solutions Engineering team as a package design lead, focusing on advanced 2.5 and 3D System in Package (SIP) designs.

Responsibilities:

• Drive the development of workflows for physical design planning, layout, and verification of advanced 3D IC designs.
• Manage package floor planning, functional/IO planning, interposer/substrate planning, and layout.
• Oversee package level connectivity, Logical Equivalence Checking (LEC), and physical DRC/DFM verification of package components.
• Collaborate with 3D IC Solutions teams to integrate workflows into the 3D IC Physical Design process.
• Utilize reference designs and customer designs for workflow development, testing, and validation.
• Provide technical support to sales and marketing design service organizations as needed.
• Travel periodically to work with customers on workflow solutions.

Qualifications:

• BS or MS in Electrical/Computer Engineering or equivalent.
• Advanced experience in package physical design and verification.

Skills:

• Experience with Advanced Packaging IC EDA tools and design methods, including 2.5D and 3D solutions.
• Proficiency in package design tools such as Cadence (APD/SiP) and Siemens (XSI/XPD).
• Knowledge of signal/power integrity analysis tools like Siemens (HyperLynx SI/PI) and Ansys (Redhawk, Totem).
• Familiarity with EDA data formats (Verilog, LEF/DEF, GDS, OASIS).
• Proficient in Windows and Linux operating systems.
• Scripting/programming skills in Python, Tcl, Perl, or similar languages; Tk-based GUI development is a plus.
• Understanding of ASIC design methodology from RTL synthesis to physical implementation phases.
• Experience with physical verification (DRC, LVS, IR/EM analysis) and DFT integration.
• Knowledge of thermal/stress analysis and optical design tools is a plus.
• Competency in Microsoft Word, Excel, and PowerPoint.