SUMMARY
We are seeking a highly skilled and detail-oriented Process Engineer to develop, optimize, and maintain surface mount assembly processes for printed circuit board assemblies (PCBA). The ideal candidate will ensure high-yield, low-defect production by improving process capability, equipment utilization, and quality assurance.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.
• Develop and maintain SMT assembly processes (screen printing, pick-and-place, reflow soldering, Wave, SPI).
• Analyze and improve process capability (Cp, Cpk), first pass yield (FPY), and overall equipment effectiveness (OEE).
• Define, monitor, and optimize reflow oven thermal profiles for lead and lead-free soldering.
• Drive root cause analysis and corrective actions for process defects (e.g., tombstoning, solder bridging, head-in-pillow).
• Support New Product Introductions (NPI) by establishing process flows, documentation, and line setup.
• Perform DFM/DFT reviews with design and test engineering teams.
• Create and update standard operating procedures (SOPs), work instructions, and training materials.
• Work closely with cross-functional teams including quality, production, R&D, and equipment engineering.
• Ensure compliance with IPC-A-610, J-STD-001, ESD, and other industry standards.
MINIMUM REQUIREMENTS
1) Bachelor's degree in Electronics, Mechanical, Mechatronics, or Industrial Engineering (or related field).
2) 4–6+ years’ experience in SMT or PCBA manufacturing environment.
3) Strong knowledge of SMT machines.
4) Well verse on ISO 134854- Medical requirements. (Will be advantage)
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.