TCB (Thermo Compression Bonding) Process Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A leading HR consultancy in Singapore is seeking a TCB Process Engineer to optimize bonding processes. The ideal candidate will have a relevant degree and 2-5 years of experience in semiconductor packaging. Responsibilities include developing process parameters, troubleshooting issues, and ensuring compliance with safety standards. This position offers a salary range of $5000 - $8000 depending on experience.

Qualifications

• Minimum 2–5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies is highly preferred.
• Experience on HBM, COWOS, 2.5D is a definite plus.

Responsibilities

• Develop and optimize TCB process parameters for bonding.
• Evaluate new materials and tools to improve performance.
• Troubleshoot yield issues related to TCB bonding.
• Define and maintain process documentation and SOPs.
• Conduct data analysis to validate process changes.
• Support NPI and technology transfers from R&D to production.
• Ensure compliance with environmental and safety standards.

Skills

Process optimization

Yield analysis

Troubleshooting

Document management

Data analysis

Collaboration with vendors

Compliance with safety standards

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Job description

Position title: TCB (Thermo Compression Bonding) Process Engineer

Location: North
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $5000 - $8000 (depends experience)

Responsibilities

• Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
• Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
• Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
• Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
• Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
• Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
• Support NPI (New Product Introduction) and technology transfers from R&D to production.
• Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
• Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
• Maintain compliance with environmental, health, and safety standards.
• Experience on HBM, COWOS, 2.5D is a definite plus.
• Experience on N2 Environment is added advantage.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands‑on experience in semiconductor packaging or advanced interconnect processes.
• Experience with TCB or similar bonding technologies (thermo‑sonic, thermocompression, eutectic bonding) is highly preferred.