Wire Bond Process Engineer: Innovate & Optimize

GMP TECHNOLOGIES (S) PTE LTD; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Restaurant or canteen facilities

Job summary

GMP Technologies (S) Pte Ltd in Singapore seeks a Wire Bonding Process Engineer to develop and improve solution sets for gold, silver, and copper bonding. You will ensure processes meet customer specs, conduct root-cause analysis for failures, and coordinate new product introductions to meet schedules.

The role requires a degree/diploma in Material Science or Electronics Engineering, plus 2–3 years in a semiconductor manufacturing environment.

Qualifications

• Requires degree or diploma in Material Science or Electronics Engineering.
• Experience with bonding wires (gold, silver, copper) preferred.
• Knowledge of IC assembly processes like die attach, wire bond, encapsulation, testing.
• Knowledge of FMEA, SPC, DOE, ISO9001/14001, QEMS, CQM, JEDEC is a plus.
• Willingness to learn and take initiative in a manufacturing setting.

Responsibilities

• Develop and improve wire bonding process capability, stability and quality.
• Ensure wire bonding processes meet customer specifications.
• Analyze failures to identify root causes and prevent recurrence.
• Coordinate NPI and NPQ activities to meet timelines.
• Qualify new products, materials, devices, and machinery.
• Train coworkers on new processes and equipment.

Skills

Team player

Independent worker

Problem solving

Interpersonal communication

Initiative

Education

Material Science / Electronics Engineering degree or diploma

Tools

ESEC wire bonder

ASM wire bonder

KNS wire bonder

Job description

GMP Technologies (S) Pte Ltd in Singapore seeks a Wire Bonding Process Engineer to develop and improve solution sets for gold, silver, and copper bonding. You will ensure processes meet customer specs, conduct root-cause analysis for failures, and coordinate new product introductions to meet schedules.

The role requires a degree/diploma in Material Science or Electronics Engineering, plus 2–3 years in a semiconductor manufacturing environment.