Process Engineer: Die Bonding & Precision Automation

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 45,000 - 67,000; Full time

Job summary

TALENT RECRUITMENT PTE. LTD. is seeking a Process Engineer in Woodlands, Singapore to develop, optimize and qualify die bonding processes and equipment.

You will set up machines, calibrate, develop recipes, and support process improvement with cross-functional teams, including R&D and Manufacturing. The role requires 2+ years in semiconductor equipment or related fields; travel to customer sites may be required; work hours 9am-6pm.

Qualifications

• Diploma or degree inMechanical/Mechatronics/Electrical/Electronics/Materials/Manufacturing/Automation or related Enginering fields.
• Minimum 2 years of relevant experience in semiconductor equipment, automation or precision manufacturing.
• Experience in Die Bonding/Die Attach, Flip-Chip, Wire Bonding, SMT, Wafer Handling or Advanced Packaging.
• Hands-on machine setup, calibration, troubleshooting and recovery.
• Knowledge of precision motion systems, sensors, vacuum and tooling.
• Experience with vision/alignment or precision positioning systems is advantageous.
• Experience with DOE, SPC, Cp/Cpk, GR&R, PQ or M/C studies for process qualification.

Responsibilities

• Develop, optimize and qualify die bonding applications, processes and equipment.
• Set up, calibrate and align machines, and develop process recipes and test procedures.
• Troubleshoot equipment and process issues, perform root cause analysis and implement corrective actions.
• Support process improvement, yield enhancement and cycle-time optimization.
• Work with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams.
• Provide technical support and training at customer sites.
• Gather customer feedback and work with R&D on product/process improvements.

Skills

Troubleshooting

Root cause analysis

DOE/ SPC analysis

Process optimization

Cross-functional collaboration

Education

Diploma or Degree in Mechanical/Mechatronics/Electrical/Electronics/Materials/Manufacturing/Automation or related Engineering

Tools

Die Bonding Equipment

Positioning systems

Job description

TALENT RECRUITMENT PTE. LTD. is seeking a Process Engineer in Woodlands, Singapore to develop, optimize and qualify die bonding processes and equipment.

You will set up machines, calibrate, develop recipes, and support process improvement with cross-functional teams, including R&D and Manufacturing. The role requires 2+ years in semiconductor equipment or related fields; travel to customer sites may be required; work hours 9am-6pm.