Process Engineer – Semiconductor Bonding Wire Manufacturing

BUSINESS EDGE PERSONNEL SERVICES PTE LTD; Singapore; Presencial; SGD 60 000 - 90 000; Tempo integral

Resumo da oferta

BUSINESS EDGE PERSONNEL SERVICES PTE LTD is seeking an engineer to advance manufacturing in a semiconductor bonding wire environment in Singapore. You will optimise production processes, troubleshoot technical issues, and drive improvements in quality, yield and efficiency.

You will evaluate new machinery and materials, monitor parameters, investigate issues and implement corrective actions to enhance reliability and workflow performance.

Qualificações

• Experience in semiconductor manufacturing environments is preferred.
• Proven ability to optimise production processes and improve yield.
• Strong problem-solving skills with a focus on quality assurance.

Responsabilidades

• Optimise manufacturing processes involving metal casting, mechanical deformation, thermo-mechanical treatment and bonding wire coating.
• Evaluate new machinery, products, manufacturing processes and raw materials.
• Monitor process parameters, investigate production issues and resolve product quality concerns.
• Analyse process variations and implement corrective and preventive actions to improve yield and product reliability.
• Support daily manufacturing operations, including process control, equipment performance, quality assurance and shipment requirements.
• Collaborate with Manufacturing, Maintenance, NPI and QA teams to improve workflows and update FMEA, Control Plans and SOPs.
• Drive continuous improvement projects involving yield enhancement, scrap reduction, productivity, cost savings and on-time delivery.
• Monitor SPC metrics and prepare performance reports.
• Work with suppliers and external partners on equipment development, automation and Industry 4.0 initiatives.
• Lead or participate in process improvement projects to enhance manufacturing efficiency and product performance.
• Initiate production lot holds and recommend rework or disposition actions in accordance with quality procedures.

Conhecimentos

Process optimization

Statistical analysis

Troubleshooting

Ferramentas

SPC

FMEA

Descrição da oferta de emprego

About the Role

Looking to advance your engineering career in semiconductor manufacturing? Join a specialised manufacturing environment focused on bonding wire technology, where you will optimise production processes, troubleshoot technical issues and drive continuous improvement in product quality, yield and manufacturing efficiency.

Key Responsibilities

• Optimise manufacturing processes involving metal casting, mechanical deformation, thermo-mechanical treatment and bonding wire coating.

• Evaluate new machinery, products, manufacturing processes and raw materials.

• Monitor process parameters, investigate production issues and resolve product quality concerns.

• Analyse process variations and implement corrective and preventive actions to improve yield and product reliability.

• Support daily manufacturing operations, including process control, equipment performance, quality assurance and shipment requirements.

• Collaborate with Manufacturing, Maintenance, New Product Introduction (NPI) and Quality Assurance teams to improve workflows and update FMEA, Control Plans and SOPs.

• Drive continuous improvement projects involving yield enhancement, scrap reduction, productivity, cost savings and on-time delivery.

• Monitor statistical process control (SPC) metrics and prepare performance reports.

• Work with suppliers and external partners on equipment development, automation and Industry 4.0 initiatives.

• Lead or participate in process improvement projects to enhance manufacturing efficiency and product performance.

• Initiate production lot holds and recommend rework or disposition actions in accordance with quality procedures.