Semiconductor Bonding Wire Process Engineer

BUSINESS EDGE PERSONNEL SERVICES PTE LTD; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

BUSINESS EDGE PERSONNEL SERVICES PTE LTD is seeking an engineer to advance manufacturing in a semiconductor bonding wire environment in Singapore. You will optimise production processes, troubleshoot technical issues, and drive improvements in quality, yield and efficiency.

You will evaluate new machinery and materials, monitor parameters, investigate issues and implement corrective actions to enhance reliability and workflow performance.

Qualifications

• Experience in semiconductor manufacturing environments is preferred.
• Proven ability to optimise production processes and improve yield.
• Strong problem-solving skills with a focus on quality assurance.

Responsibilities

• Optimise manufacturing processes involving metal casting, mechanical deformation, thermo-mechanical treatment and bonding wire coating.
• Evaluate new machinery, products, manufacturing processes and raw materials.
• Monitor process parameters, investigate production issues and resolve product quality concerns.
• Analyse process variations and implement corrective and preventive actions to improve yield and product reliability.
• Support daily manufacturing operations, including process control, equipment performance, quality assurance and shipment requirements.
• Collaborate with Manufacturing, Maintenance, NPI and QA teams to improve workflows and update FMEA, Control Plans and SOPs.
• Drive continuous improvement projects involving yield enhancement, scrap reduction, productivity, cost savings and on-time delivery.
• Monitor SPC metrics and prepare performance reports.
• Work with suppliers and external partners on equipment development, automation and Industry 4.0 initiatives.
• Lead or participate in process improvement projects to enhance manufacturing efficiency and product performance.
• Initiate production lot holds and recommend rework or disposition actions in accordance with quality procedures.

Skills

Process optimization

Statistical analysis

Troubleshooting

Tools

SPC

FMEA

Job description

BUSINESS EDGE PERSONNEL SERVICES PTE LTD is seeking an engineer to advance manufacturing in a semiconductor bonding wire environment in Singapore. You will optimise production processes, troubleshoot technical issues, and drive improvements in quality, yield and efficiency.

You will evaluate new machinery and materials, monitor parameters, investigate issues and implement corrective actions to enhance reliability and workflow performance.