Die Bond Process Engineer - Optimize & Troubleshoot

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

TALENT RECRUITMENT PTE. LTD. is seeking an Application / Process Engineer (Die Bond Tools) to develop and optimize die bonding processes and equipment at our Woodlands facility.

You will calibrate machines, create process recipes, troubleshoot issues, and collaborate with R&D, software, mechanical, electrical, manufacturing and quality teams. Candidates should have a diploma/degree in relevant engineering and at least 2 years' experience in semiconductor equipment or precision manufacturing.

Qualifications

• Diploma or degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering.
• Minimum 2 years of relevant experience in semiconductor equipment, automation, advanced packaging or precision manufacturing.
• Experience in Die Bonding/Die Attach, Flip-Chip, Wire Bonding, SMT, Wafer Handling, Semiconductor Automation, Precision Robotics or Advanced Packaging.
• Hands-on experience in machine setup, calibration, troubleshooting, parameter adjustment and recovery.
• Knowledge of precision motion systems, servo systems, sensors, vacuum, pneumatics and tooling.
• Experience with vision/alignment or precision positioning systems is advantageous.
• Familiar with structured problem-solving and RCA methods such as 5-Why, Fishbone, 8D, DOE or FMEA.
• Willing to travel to customer sites when required.

Responsibilities

• Develop, optimize and qualify die bonding applications, processes and equipment.
• Set up, calibrate and align machines, and develop process recipes and test procedures.
• Troubleshoot equipment and process issues, perform root cause analysis and implement corrective actions.
• Support process improvement, yield enhancement and cycle-time optimization.
• Work closely with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams.
• Provide technical support, installation and application assistance at customer sites.
• Conduct customer training and provide technical support to Field Application Engineers.
• Gather customer feedback and work with R&D on product and process improvements.

Skills

Die Bonding

Process Engineering

DOE/SPC

Root Cause Analysis

Education

Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering

Tools

Vision/Alignment Systems

Servo/Motion Systems

Vacuum & Pneumatics

Job description

TALENT RECRUITMENT PTE. LTD. is seeking an Application / Process Engineer (Die Bond Tools) to develop and optimize die bonding processes and equipment at our Woodlands facility.

You will calibrate machines, create process recipes, troubleshoot issues, and collaborate with R&D, software, mechanical, electrical, manufacturing and quality teams. Candidates should have a diploma/degree in relevant engineering and at least 2 years' experience in semiconductor equipment or precision manufacturing.