Process Engineer (Wire Bond)

GMP TECHNOLOGIES (S) PTE LTD; Singapore; On-site; SGD 60,000 - 90,000; Full time

Benefits offered by this job

Restaurant or canteen facilities

Job summary

GMP Technologies (S) Pte Ltd in Singapore seeks a Wire Bonding Process Engineer to develop and improve solution sets for gold, silver, and copper bonding. You will ensure processes meet customer specs, conduct root-cause analysis for failures, and coordinate new product introductions to meet schedules.

The role requires a degree/diploma in Material Science or Electronics Engineering, plus 2–3 years in a semiconductor manufacturing environment.

Qualifications

• Requires degree or diploma in Material Science or Electronics Engineering.
• Experience with bonding wires (gold, silver, copper) preferred.
• Knowledge of IC assembly processes like die attach, wire bond, encapsulation, testing.
• Knowledge of FMEA, SPC, DOE, ISO9001/14001, QEMS, CQM, JEDEC is a plus.
• Willingness to learn and take initiative in a manufacturing setting.

Responsibilities

• Develop and improve wire bonding process capability, stability and quality.
• Ensure wire bonding processes meet customer specifications.
• Analyze failures to identify root causes and prevent recurrence.
• Coordinate NPI and NPQ activities to meet timelines.
• Qualify new products, materials, devices, and machinery.
• Train coworkers on new processes and equipment.

Skills

Team player

Independent worker

Problem solving

Interpersonal communication

Initiative

Education

Material Science / Electronics Engineering degree or diploma

Tools

ESEC wire bonder

ASM wire bonder

KNS wire bonder

Job description

Responsibilities

• Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
• Ensure wire bonding process meets customer's specifications and requirements
• Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
• Co-ordinate NPI and NPQ activities to meet given timeline
• Qualify new product, material, device, and machinery
• Participate in new tape development, and new material development activities
• Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
• Benchmark new materials and new equipment technology in the market
• Train co-workers on new process implementation and new machinery operations
• Maintain, troubleshoot, and perform minor repair of assembly and test machinery
• Develop new and update existing Standard Operating Procedures
• Participate in internal audits, customers' audits and external audits
• Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Requirements

• Degree or Diploma in Material Science / Electronics Engineering
• Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)
• Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
• Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
• Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing
• Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
• Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
• Good in problem solving, excellent interpersonal and communication skill

GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960