Staff / Senior Staff Engineer Package Technology Development

Infineon Technologies AG; Singapore; On-site; SGD 180,000 - 230,000; Full time

Job summary

Infineon Technologies AG in Singapore seeks a Staff/Senior Staff Engineer for Package Technology Development. You will drive outsourced package platform qualification, process optimization, and integration across subcons to ensure timely, high-quality product delivery in a multi-site environment.

The role requires a strong background in module assembly, WLP, bumping, and SiP, with leadership in cross-functional teams and risk-based decision making.

Qualifications

• 10+ years in package development for new product introduction.
• 3+ years in project management.
• Experience with WLP, module assembly, OSAT.
• Strong communication and team collaboration across sites.
• Knowledge of JEDEC/AEC release criteria.

Responsibilities

• Lead outsourced package platform qualification and process optimization at subcons to meet time-to-market and quality targets.
• Define project complexity and perform risk assessment with mitigation actions in OSAT scope.
• Create assembly and packing specifications for databases and ensure proper process integration.
• Apply design rules based on baseline documents and assess OSATs capability.
• Define BOM and packaging requirements to meet MSL and reliability targets.
• Enable new package platforms and derivatives with OSAT support.

Skills

Package development

Project management

Global collaboration

Analytical thinking

Communication skills

Education

Bachelor or Master in Engineering

Job description

Role Overview

WeAreIn for jobs that impact everyone's life. What if your ideas could change the way the world connects, powers up, or thinks? As a Staff / Senior Staff Engineer Package Technology Development in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Key Responsibilities

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time‑to‑market, product quality level, process capability and assembly yield target.
• Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment and performing a project risk assessment with mitigation actions.
• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction and packing specification for upload into Database.
• Apply and verify design rules based on established baseline documents as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role.
• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre‑development.
• Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role.
• As a driver or co‑driver for platform related Task force activities and has ability to drive for technical problem solving.

Qualifications

• Master or Bachelor degree in Engineering disciplines.
• Minimum 10 years’ working experience of package development in new product introduction or process (pre-assembly, assembly and test) and 3 years in supporting project management.
• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB and System in Package (SiP) will be a key advantage.
• Good knowledge of processes and material in both laminates and leadframe packages and interaction to the different functions (laminate/leadframe design, design rules, process).
• Good understanding of quality requirements / release criteria (e.g. JEDEC/AEC grade) that fits and matches product/package design and BOM sets selection.
• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind‑set and excellent problem solving.
• Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decisions.
• Highly motivated with the ability to prioritize, perform under pressure and get team members and stakeholders involved and to motivate them.
• Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams.
• Strong in communication and people interpersonal skills across all levels.
• Experience in Subcon management.

Contact

Carol Lee