Senior Advanced Packaging Engineer

the supreme hr advisory pte. ltd.; Shenton Way; On-site; SGD 89,000 - 112,000; Full time

Job summary

HBM is seeking a Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) to join its team in Singapore. You will drive application engineering for TCB, Flip Chip, CoWoS, and 2.5D/3D packaging, align with customer roadmaps and support technical discussions.

The role requires 5+ years in semiconductor advanced packaging, hands-on experience with TCB, NPI, Process/Equipment qualification, and collaboration across engineering disciplines.

Qualifications

• Minimum 5 years experience in semiconductor advanced packaging.
• Hands-on experience in TCB, Advanced Packaging Process Development, Flip Chip Assembly, NPI, Process Qualification, Equipment Qualification, Manufacturing Engineering, Customer Process Development.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving Thermo Compression Bonding (TCB), Flip Chip Assembly, Hybrid Bonding, HBM Packaging, CoWoS, CoPoS, 2.5D/3D Packaging, Chiplet Integration, Large Die Packaging.
• Evaluate and optimize bond force, temperature profiles, process windows, alignment accuracy, package warpage, yield, reliability.
• Work closely with multidisciplinary teams to define machine architecture, functional specifications, accuracy requirements, throughput targets, thermal performance, bonding process capability, reliability requirements, customer acceptance criteria.

Skills

TCB

Advanced Packaging

NPI

Process Qualification

Equipment Qualification

Manufacturing Engineering

DOE

Yield Improvement

Reliability Testing

Failure Analysis

Package Warpage

Thermal Management

Alignment Accuracy

Semiconductor Manufacturing

Education

Materials Engineering

Mechanical Engineering

Electrical Engineering

Chemical Engineering

Physics

Semiconductor Engineering

Related Engineering disciplines

Job description

Position title : Senior Advanced Packaging Application Engineer (Thermo Compression Bonding – TCB) | HBM | CoWoS | 2.5D/3D Packaging | Flip Chip | Advanced Semiconductor Packaging | Process Development

• Location: Admirax St
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum5 yearsexperience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.