Senior MTS, Advanced Packaging Integration

applied materials south east asia pte. ltd.; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Applied Materials is seeking an Advanced Packaging Integration Engineer to join the Advanced Packaging Disruptive Technology team. This role focuses on advanced packaging process integration, thin film deposition and etching techniques, and driving innovation across manufacturing processes.

The candidate will lead complex technology projects, collaborate with cross-functional teams, and contribute to patents and publications while delivering scalable solutions for high-end packaging applications.

Qualifications

• Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD with 5 years in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
• Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration.
• Experience with fan-out panel-level packaging (FOPLP), substrate technology and wafer back-end.
• Knowledge of industry standards in semiconductor packaging.
• Strong understanding of semiconductor packaging technologies and process flows.
• Ability to work in fast-paced environment and cleanroom.

Responsibilities

• Define and implement process flows for panel-level packaging and advanced panel technologies.
• Drive material selection and compatibility studies for large-format form factors.
• Keeps abreast of new developments and publishes in ET conferences and journals.
• Develop innovative solutions and contribute to patents and awards.
• Conceive and implement new technology and guide engineers in applying methods to complex systems.
• Work with design, reliability, and materials teams to ensure manufacturability and performance.

Skills

Advanced packaging

Process integration

Thin film deposition

PVD/CVD/ALD

ECD deposition

Problem solving

Communication skills

Cleanroom experience

Education

Bachelor's degree

Master's degree

PhD

Job description

We are seeking a highly skilled Advanced Packaging Integration Engineer to join the Applied Materials Advanced Packaging Disruptive Technology team. This role focuses on advanced advanced packaging process integration, with a focus on thin film deposition and etching techniques towards driving innovation and ensuring seamless integration across manufacturing processes. This technical staff position leads and/or develops and executes exceptionally complex technology and engineering projects and leads research and development of new technologies as appropriate.

Key Responsibilities

Advanced Packaging Process Development

• Define and implement process flows for panel-level packaging and other advanced panel technologies.
• Drive material selection and compatibility studies for large-format form factors.
• Keeps abreast of new developments in own and related technology groups. Participates in publishing in ET conferences and journals.
• Develop innovative solutions as part of proven track record of significant technology contributions. Recognized internally (across Business Units) as one of the limited number of technical experts in their field of expertise
• Conceive and implement new technology, normally named as primary inventor on numerous critical patents and recognized through awards and/or published papers within the last five years.
• Leads and collaborates to contribute to the development of new principles and concepts. Guides less experienced engineers in utilizing techniques to define methods and new technologies and apply them on unusually complex systems. Involved in judging the approach and verifying the validity of technical strategies.

Functional Knowledge

• Optimize thin film deposition techniques such as Physical Vapor Deposition (PVD),Chemical Vapor Deposition (CVD) (Including PECVD for low-temperature applications), Atomic Layer Deposition (ALD) for atomic-scale control and high-k dielectrics.
• Electrochemical Deposition (ECD): For metal layers in advanced packaging.

Cross-Functional Collaboration

• Works with business unit in technology development and transfer to customers including customized process development. Plans unit process sequence based on customer requirements. Negotiates process specifications and service offerings with customers. Takes ownership of delivering the required solution to the customers that meets specification.
• Serves as the customer expert across a broad range of products.Plays a key role in defining product strategy and identifying gaps.Provides feedback to business unit heads on process and hardware improvements to meet customer roadmap requirements.
• Work closely with design, reliability, and materials teams to ensure manufacturability and performance.
• Support technology transfer from development to high-volume manufacturing.
• Provides oversight of customer demos, including defining demo conditions and analyzing results.

Data Analysis and Continuous Improvement

• Analyze process data for trend identification and optimization.
• Drive continuous improvement initiatives for unit level process and cycle time improvement.
• Conduct root cause analysis for defects and implement corrective actions to improve yield and reliability.
• Within safety guidelines design, perform, collect data, analyze and compile reports on unusually complex engineering experiments and provides solutions which are highly innovative and ingenious.

Requirements

• Bachelor’s degree with 15 years of experience, Master’s degree with 10 years or PhD degree with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
• Expertise in thin film deposition techniques and dielectric etch and panel packaging process integration.
• Experience with advanced packaging technologies such as fan-out panel-level packaging (FOPLP), substrate technology and wafer Back-end technology.
• Knowledge of industry standards and best practices in semiconductor packaging.
• Strong understanding of semiconductor packaging technologies and process flows.
• Strong knowledge of process characterization and troubleshooting.
• Excellent problem-solving skills and ability to work in a fast-paced environment.
• Ability to work in a cleanroom environment
• Excellent communication skills

Work Location

• Science Park II (Moving to Tampines in end 2026)