Technical Program Lead, Semiconductor Packaging

SILICON BOX; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

SILICON BOX is seeking a Technical Program Specialist to manage customers’ technical projects in semiconductor assembly and wafer-level packaging. The role involves coordinating cross-functional teams, communicating requirements, and supporting sales to grow profitability.

The ideal candidate has a bachelor’s degree in engineering and 2–3 years’ experience in back-end assembly, with knowledge of wafer bumping, eWLB, or fanout packaging and familiarity with SAP or ERP systems.

Qualifications

• Bachelor’s Degree in any engineering discipline.
• 2–3 years of experience in the assembly process of the back end of semiconductor production.
• Knowledge of wafer-level packaging such as wafer bumping, eWLB or fanout packaging.
• Familiarity with DOE, reliability, FMEA, and basic quality tools; SAP or ERP systems is a plus.

Responsibilities

• Collaborate with account management and customer service on technical aspects of engagements.
• Provide technical support to sales to improve market share and profitability.
• Communicate customer technology requirements to internal teams and manage packaging roadmaps.
• Coordinate factory/customer projects and act as the point of contact for quality/reliability programs.
• Implement change notices and resolve technical issues.
• Prepare and participate in audits and factory visits with customers.
• Perform other ad-hoc activities as directed by management.

Skills

Problem solving

Communication

Teamwork

Self-driven

Education

Bachelor's Degree in engineering

Tools

SAP

Job description

SILICON BOX is seeking a Technical Program Specialist to manage customers’ technical projects in semiconductor assembly and wafer-level packaging. The role involves coordinating cross-functional teams, communicating requirements, and supporting sales to grow profitability.

The ideal candidate has a bachelor’s degree in engineering and 2–3 years’ experience in back-end assembly, with knowledge of wafer bumping, eWLB, or fanout packaging and familiarity with SAP or ERP systems.