Senior Packaging Designer - Wafer-Level & PCB Systems

SILICON BOX; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

SILICON BOX is seeking a Packaging Designer in Singapore to lead product and tooling design within advanced packaging environments. The role involves collaborating with internal and external customers to translate requirements into robust PCB and packaging schemes.

You should have a Master’s in Electrical Engineering or a Bachelor’s with substantial experience, plus hands-on experience with fan-in/fan-out processes, wafer bumping, WLCSP, BGA and related tooling.

Qualifications

• Master's degree or higher in electrical engineering or a closely related field.
• Minimum 5-10 years of relevant experience with high-speed packaging.
• Experience with wafer bumping, WLCSP, BGA or fan-out packaging is advantageous.

Responsibilities

• Generate, update and revise electrical routing layouts from internal or external nets.
• Design test vehicles and related PCB layouts.
• Create reticle and stencil designs.
• Document drawing revisions and change records.
• Maintain design guidelines and support supplier handoffs.

Skills

Electrical engineering

PCB design

Risk assessment

Design guidelines

Education

Master's Degree in Electrical Engineering

Bachelor's Degree with 5-10 years experience

Tools

Cadence APD

LinkCAD

CAM350

AutoCAD

GDS

Gerber editors

Job description

SILICON BOX is seeking a Packaging Designer in Singapore to lead product and tooling design within advanced packaging environments. The role involves collaborating with internal and external customers to translate requirements into robust PCB and packaging schemes.

You should have a Master’s in Electrical Engineering or a Bachelor’s with substantial experience, plus hands-on experience with fan-in/fan-out processes, wafer bumping, WLCSP, BGA and related tooling.