Lead Equipment Engineer, Semiconductor Packaging

SILICON BOX; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

SILICON BOX in Singapore is seeking an Equipment Engineer to provide technical leadership for the startup and optimization of next-generation Fanout packaging equipment. This role will drive equipment capability, quality, and utilization through CIP to meet company goals.

You will plan new equipment startups, establish PM programs, collaborate with vendors, manage safety risks, and lead improvement projects to boost productivity and reduce costs.

Qualifications

• Bachelor degree or diploma for senior level in engineering with strong hands-on equipment experience.
• Experience in wafer-level Fanout / WLCSP packaging is preferred.
• Strong problem-solving, analytical, and leadership abilities; capable of coaching technicians.

Responsibilities

• Provide technical leadership for startup of next-gen fanout packaging equipment.
• Plan and manage new equipment startup from facilities hookup to production acceptance.
• Establish PM plans and optimize for quality, cost, and productivity.
• Collaborate with vendors to resolve equipment issues and improve performance.
• Identify safety and process risks and implement mitigations and safe procedures.
• Lead equipment improvement projects to enhance efficiency and reduce costs.
• Forecast budgets and set tracking for equipment expenditures.
• Set targets to minimize scrap and optimize equipment utilization.
• Provide training to AEs and TAs on troubleshooting and equipment knowledge.

Skills

Leadership

Problem solving

Analytical skills

Team player

Work under pressure

Education

Bachelor Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering

Diploma with minimum 8 years of relevant experience

Tools

SPC

DOE

FDC

ECMS

Datacon Chameo/Nucleus die-bonder

Job description

SILICON BOX in Singapore is seeking an Equipment Engineer to provide technical leadership for the startup and optimization of next-generation Fanout packaging equipment. This role will drive equipment capability, quality, and utilization through CIP to meet company goals.

You will plan new equipment startups, establish PM programs, collaborate with vendors, manage safety risks, and lead improvement projects to boost productivity and reduce costs.