Technical Program Manager

SILICON BOX; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

SILICON BOX in Singapore seeks a Technical Program Manager to oversee customers’ technical projects and ensure seamless execution across all stages.

Ideal candidates have deep experience in wafer bumping, WLCSP, or fanout packaging, can coordinate cross-functional teams, and drive quality and reliability programs with SAP/ERP familiarity.

Qualifications

• Min 5-7 years of relevant experience in the back-end assembly process of semiconductor production.
• Experience in wafer-level packaging such as wafer bumping, eWLB or fanout packaging.
• Knowledge of DOE, reliability requirements, material selection, FMEA, Failure Analysis and related quality tools.
• Self-driven with excellent problem resolution and organizational skills for daily customer support and program management.
• Demonstrates initiative and proactive follow-up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross-functional teams.
• Familiarity with SAP or other ERP systems is an added advantage.

Responsibilities

• Works with sales managers and customer service on all technical aspects of customer engagements.
• Provides technical support to the sales team to gain market share and improve profitability.
• Communicates new customer technology requirements to internal teams and manages product roadmaps.
• Coordinates factory and customer technical projects and serves as the point of contact for new quality/reliability programs.
• Implements change notices and resolves technical issues.
• Prepares for and participates in audits and factory visits with customers.
• Performs other ad-hoc activities assigned by management.

Skills

Project management

Customer communication

Problem solving

Team collaboration

Presentation skills

Tools

SAP

ERP familiarity

Job description

The Technical Program Manager is responsible for overall management of customers’ technical projects and related matters.

Candidates with wafer bumping, WLCSP, or fanout packaging experience are encouraged to apply for this position.

Responsibilities

• Works with sales managers and customer service in all technical aspects of the customers’ engagements
• Provides technical support to sales team to gain market share and improve customers’ profitability status.
• Communicates new customer technology requirements to the internal teams. Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and act as the point of contact for new quality/reliability programs.
• Implements change notices, resolves technical issues.
• Prepares and participate in audits and factory visits with customers.
• Other ad-hoc activities assigned by the management.

Requirements

• Min 5 - 7 years of relevant working experience in the assembly process of the back end of semiconductor production.
• Possess good knowledge and hands-on experience in assembly processes especially in wafer-level packaging like wafer bumping, eWLB or other wafer-level Fanout Packaging.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on-going and future programs.
• Has initiative and demonstrate excellent follow-up on active programs with multiple customers.
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and cross-functional teams within the organization.
• Familiarity with SAP or other ERP systems is an added advantage.