Director of Pathfinding in Advanced Packaging

Applied Materials, Inc.; Singapore; On-site; SGD 220,000 - 300,000; Full time

Job summary

Applied Materials, Inc. in Singapore seeks a visionary leader to define and drive pathfinding for next‑gen packaging technologies, shaping future integration architectures and new value creation.

You will build and lead a high‑impact team focused on exploratory, pre‑product technologies and connect emerging inflections to customer roadmaps. This role combines technology disruption with market insight to translate early ideas into scalable, differentiated solutions that advance our packaging

Qualifications

• 15+ years of experience in semiconductor technology, including advanced packaging, front-end processing, or adjacent domains.
• Demonstrated leadership in technology pathfinding, innovation strategy, or early-stage platform development.
• Strong understanding of current advanced packaging technologies (D2W, RDL, CoWoS, TSV, etc).
• Proven experience building and leading cross-functional or exploratory R&D teams.

Responsibilities

• Define and execute long-range pathfinding roadmap for advanced packaging beyond current platforms.
• Build, lead, and inspire a world-class pathfinding and innovation team.
• Translate customer roadmaps and market trends into actionable technology development strategies.
• Develop ecosystem partnerships and drive joint development programs to shape industry direction.

Skills

Advanced packaging

Leadership

R&D management

Cross-functional teams

Strategy development

Education

PhD/MS in relevant field

Job description

Applied Materials, Inc. in Singapore seeks a visionary leader to define and drive pathfinding for next‑gen packaging technologies, shaping future integration architectures and new value creation.

You will build and lead a high‑impact team focused on exploratory, pre‑product technologies and connect emerging inflections to customer roadmaps. This role combines technology disruption with market insight to translate early ideas into scalable, differentiated solutions that advance our packaging